EP3SE50F484C4LN vs EP3SE50F484I3N 比較

詳細並排比較 EP3SE50F484C4LN 由 Intel 與 EP3SE50F484I3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE50F484C4LN EP3SE50F484I3N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND NRND
Family Stratix III E Stratix III E
Logic Elements (LE) 47,500 —
LABs/CLBs 1900 —
Total RAM Bits 2,344,448 (2286 Kbit) —
Number of I/O 296 —
Number of Multipliers (18x18) 384 —
Voltage - Supply (Core) 0.85 V to 1.1 V —
Voltage - Supply (I/O) 1.5 V / 1.8 V / 2.5 V / 3.3 V —
安裝類型 Surface Mount Surface Mount (BGA)
工作溫度 0C to +85C (commercial) -40C to +100C (industrial)
封裝 / 外殼 484-BBGA, FCBGA (FineLine BGA) —
Lead Free / RoHS Lead free / RoHS compliant —
Process Node 40 nm CMOS —
Speed Grade C4 I3 (industrial, bin 3)
Configuration FPP / AS / JTAG —
Logic Elements — 47,500
Number of LABs — 1,900
Total Memory Bits — 5,760,000
Maximum User I/O — 296
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Core Voltage VCC — 0.9 V
Auxiliary Voltage VCCAUX — 1.1 V
Process Technology — 65 nm
Maximum Internal Frequency — 500 MHz
封裝 — 484-pin FC-FBGA (flip-chip BGA)
Lead-Free / RoHS — Yes (N suffix)
Configuration Method — Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP)
DSP Blocks — [DATA_NEEDED: number of DSP blocks]
Embedded Multipliers (18x18) — [DATA_NEEDED: number of 18x18 multipliers]
Transceiver Count — [DATA_NEEDED: number of embedded transceivers]

資料表與資源

瀏覽所有產品 建立 BOM 索取報價