EP3SE50F780C4N vs EP3SE50F780C4L Perbandingan
Perbandingan bersamaan detil EP3SE50F780C4N dari Intel dan EP3SE50F780C4L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE50F780C4N | EP3SE50F780C4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III E | Stratix III |
| Logic Elements (LE) | 47,500 | 47,500 |
| Embedded Memory Bits | 5,760,000 | — |
| Embedded Memory (M9K/M144K blocks) | 488 (per family datasheet) | — |
| Number of LABs | 1900 | — |
| Maximum User I/Os | 488 | — |
| DSP Blocks (18x18 multipliers) | 432 | 304 (19x16) |
| PLLs | 12 (per family datasheet) | [DATA_NEEDED: PLL count] |
| Maximum Operating Frequency | 717 MHz | — |
| Transceiver Channels | Up to 12 (per family, model-dependent) | — |
| Transceiver Data Rate | Up to 6.375 Gbps (per Stratix III E family) | — |
| Process Node | 40 nm | 40 nm |
| Paket | 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch | 780-ball FCBGA (Flip-Chip BGA) |
| Tipe Mounting | Surface Mount (BGA) | — |
| Tegangan Pemuat | Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail) | — |
| Suhu Kerja | 0C to +85C (C4 commercial grade) | [DATA_NEEDED: full industrial/commercial grade] |
| Configuration Modes | JTAG, Passive Serial, Fast Passive Parallel | — |
| Status RoHS | Lead-free / RoHS compliant | Compliant (lead-free) |
| Level MSL | 3 (per JEDEC J-STD-020, FBGA package) | — |
| Hard Memory Controller | DDR2/DDR3 SDRAM (per Stratix III E family) | — |
| Series | — | Stratix III E |
| Embedded Memory | — | 5,760,000 bits |
| User I/Os | — | 488 |
| Core Voltage | — | 1.1 V |
| Speed Grade | — | C4 (commercial, speed 4) |
| Lead-Free (L suffix) | — | Yes |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG / Enhanced |
| Transceivers | — | [DATA_NEEDED: per Stratix III E variant] |