EP3SL200H780C4L vs EP3SL200H780C2 Perbandingan
Perbandingan bersamaan detil EP3SL200H780C4L dari Intel dan EP3SL200H780C2 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SL200H780C4L | EP3SL200H780C2 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III | Stratix III L |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 200,000 | 200,000 |
| Embedded Memory | 6.5 Mbit | — |
| User I/O Count | 488 | 488 |
| Package Type | 780-ball FCBGA (FineLine BGA, HBGA) | — |
| Package Code | BGA-780 / PBGA780 / HBGA-780 | — |
| Package Mounting | Surface Mount | — |
| Internal Logic Frequency | up to 717 MHz (per ampheo datasheet brief) | — |
| Speed Grade | -4 (medium performance, commercial) | — |
| Suhu Kerja | 0C to 85C (commercial) | 0C to +85C (Commercial) |
| Lead-Free / Pb-Free | Yes (L suffix, lead-free) | — |
| Status RoHS | Compliant | Compliant |
| Process Technology | TSMC 40 nm | — |
| Configuration Modes | FPP, AS, PS, JTAG | — |
| LABs / CLBs | — | 8000 |
| Total Memory Bits | — | 10,901,504 |
| Paket | — | 780-BBGA, FCBGA |
| Tipe Mounting | — | Surface Mount |
| Level MSL | — | [DATA_NEEDED: MSL level] |
| Process Node | — | 65 nm |
| Voltage - Core | — | [DATA_NEEDED: core voltage] |
| Voltage - I/O | — | [DATA_NEEDED: I/O voltage] |
| DSP Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Transceivers | — | [DATA_NEEDED: transceiver count for H780] |
| Lead Free | — | Yes |