EP3SL200H780C4L vs EP3SL200H780C2 Vergleich
Detaillierter Direktvergleich von EP3SL200H780C4L von Intel und EP3SL200H780C2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SL200H780C4L | EP3SL200H780C2 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $6.459,35 | $6.950,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III | Stratix III L |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 200,000 | 200,000 |
| Embedded Memory | 6.5 Mbit | — |
| User I/O Count | 488 | 488 |
| Package Type | 780-ball FCBGA (FineLine BGA, HBGA) | — |
| Package Code | BGA-780 / PBGA780 / HBGA-780 | — |
| Package Mounting | Surface Mount | — |
| Internal Logic Frequency | up to 717 MHz (per ampheo datasheet brief) | — |
| Speed Grade | -4 (medium performance, commercial) | — |
| Betriebstemperatur | 0C to 85C (commercial) | 0C to +85C (Commercial) |
| Lead-Free / Pb-Free | Yes (L suffix, lead-free) | — |
| RoHS-Status | Compliant | Compliant |
| Process Technology | TSMC 40 nm | — |
| Configuration Modes | FPP, AS, PS, JTAG | — |
| LABs / CLBs | — | 8000 |
| Total Memory Bits | — | 10,901,504 |
| Gehäuse | — | 780-BBGA, FCBGA |
| Montageart | — | Surface Mount |
| MSL-Level | — | [DATA_NEEDED: MSL level] |
| Process Node | — | 65 nm |
| Voltage - Core | — | [DATA_NEEDED: core voltage] |
| Voltage - I/O | — | [DATA_NEEDED: I/O voltage] |
| DSP Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Transceivers | — | [DATA_NEEDED: transceiver count for H780] |
| Lead Free | — | Yes |