EP3SL50F780C2 vs EP3SL70F780C2G Perbandingan
Perbandingan bersamaan detil EP3SL50F780C2 dari Intel dan EP3SL70F780C2G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SL50F780C2 | EP3SL70F780C2G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Stratix III L | Stratix III L |
| Logic Elements (LE) | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | — |
| Embedded Memory (bits) | 2,184,192 | — |
| Maximum User I/Os | 488 | — |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | — |
| Paket | 780-ball FCBGA (Flip-Chip BGA) | 780-ball FCBGA (FineLine BGA) |
| Suhu Kerja | 0°C to +85°C (commercial) | — |
| Maximum Core Frequency | 600 MHz | — |
| Configuration Interface | JTAG / passive serial / fast passive parallel | — |
| I/O Standards | LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces | — |
| Embedded Memory Type | TriMatrix (MLAB, M9K, M144K blocks) | — |
| Status RoHS | Compliant | Compliant |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Logic Elements | — | 67,500 |
| Embedded Memory | — | 2,699,264 bits |
| User I/O Count | — | 488 |
| Speed Grade | — | C2 (medium) |
| Temperature Grade | — | Commercial (0 C to 85 C) |
| Process Node | — | 40 nm low-power CMOS |
| Core Voltage (VCC) | — | 0.9 V |
| DSP Blocks | — | Yes (dedicated) |
| Memory Interfaces Supported | — | DDR3, DDR2, QDR II+, RLDRAM II |
| PCIe Hard IP | — | Gen1/Gen2 |
| Transceivers | — | [DATA_NEEDED: transceiver count and data rate] |
| PLLs | — | Fractional PLLs |