EP4CE55F23C8L vs EP4CE55F23C9L Perbandingan
Perbandingan bersamaan detil EP4CE55F23C8L dari Intel dan EP4CE55F23C9L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CE55F23C8L | EP4CE55F23C9L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements | 55,856 | — |
| Embedded Memory (bits) | 2,396,160 | — |
| Number of I/Os | 324 | — |
| Number of LABs/CLBs | 3491 | — |
| Core Voltage | 1.2 V | 1.2 V (typical) |
| Process Technology | 60 nm | — |
| Paket | 484-FBGA | 484-ball FBGA (F23) |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Suhu Kerja | 0 C to +85 C | -40C to +85C (industrial) |
| Speed Grade | C8 | C9 (fastest commercial/industrial) |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Configuration Method | SRAM (volatile) / Passive Serial / JTAG | SRAM-based, requires external flash |
| On-Chip 18x18 Multipliers | 156 | — |
| Logic Elements (LE) | — | 55,856 |
| Embedded Memory | — | 2,396,160 bits (2.5 Mbit) |
| Embedded 18x18 Multipliers | — | 156 |
| PLLs | — | 4 |
| User I/Os | — | 324 |
| Process Node | — | 60 nm low-power |
| Level MSL | — | [DATA_NEEDED: MSL level] |
| Hard PCIe Blocks | — | 0 (soft PCIe via fabric) |