EP4CE55F23C8L vs EP4CE55F23C9L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CE55F23C8L disebabkan oleh Intel dan EP4CE55F23C9L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CE55F23C8L | EP4CE55F23C9L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements | 55,856 | — |
| Embedded Memory (bits) | 2,396,160 | — |
| Number of I/Os | 324 | — |
| Number of LABs/CLBs | 3491 | — |
| Core Voltage | 1.2 V | 1.2 V (typical) |
| Process Technology | 60 nm | — |
| Kemasan | 484-FBGA | 484-ball FBGA (F23) |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Suhu Operasi | 0 C to +85 C | -40C to +85C (industrial) |
| Speed Grade | C8 | C9 (fastest commercial/industrial) |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Configuration Method | SRAM (volatile) / Passive Serial / JTAG | SRAM-based, requires external flash |
| On-Chip 18x18 Multipliers | 156 | — |
| Logic Elements (LE) | — | 55,856 |
| Embedded Memory | — | 2,396,160 bits (2.5 Mbit) |
| Embedded 18x18 Multipliers | — | 156 |
| PLLs | — | 4 |
| User I/Os | — | 324 |
| Process Node | — | 60 nm low-power |
| Aras MSL | — | [DATA_NEEDED: MSL level] |
| Hard PCIe Blocks | — | 0 (soft PCIe via fabric) |