EP4CE55F23C8L vs EP4CE55F23C9L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE55F23C8L sa pamamagitan ng Intel at EP4CE55F23C9L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE55F23C8L | EP4CE55F23C9L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements | 55,856 | — |
| Embedded Memory (bits) | 2,396,160 | — |
| Number of I/Os | 324 | — |
| Number of LABs/CLBs | 3491 | — |
| Core Voltage | 1.2 V | 1.2 V (typical) |
| Process Technology | 60 nm | — |
| Packhaging | 484-FBGA | 484-ball FBGA (F23) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Temperature na Operasyon | 0 C to +85 C | -40C to +85C (industrial) |
| Speed Grade | C8 | C9 (fastest commercial/industrial) |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Configuration Method | SRAM (volatile) / Passive Serial / JTAG | SRAM-based, requires external flash |
| On-Chip 18x18 Multipliers | 156 | — |
| Logic Elements (LE) | — | 55,856 |
| Embedded Memory | — | 2,396,160 bits (2.5 Mbit) |
| Embedded 18x18 Multipliers | — | 156 |
| PLLs | — | 4 |
| User I/Os | — | 324 |
| Process Node | — | 60 nm low-power |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Hard PCIe Blocks | — | 0 (soft PCIe via fabric) |