Intel

EP4CE6E22A7N - Cyclone IV E FPGA, 6K LEs, 144-EQFP | Intel

MPN: EP4CE6E22A7N ✓ Aktif

1.2 V Vdss 144-pin EQFP (E22) with exposed pad Package 10 Speed 276,480 Memory

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EP4CE6E22A7N Ringkasan

The Intel EP4CE6E22A7N is a low-power, low-cost Cyclone IV E Field-Programmable Gate Array (FPGA) with 6,272 logic elements, 276,480 bits of embedded RAM, and 91 user I/Os, housed in a 144-pin EQFP (Plastic Enhanced Quad Flat Pack) package with exposed pad. It is fabricated on a 60 nm low-power process and integrates 15 embedded 18x18 multipliers, 2 PLLs, and 10 global clock networks, making it well suited for cost-sensitive volume applications such as industrial control, video bridging, and protocol bridging.

A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the digital logic hierarchy between fixed-function ASICs and software-defined processors: an FPGA offers ASIC-level deterministic parallelism while remaining fully reprogrammable in the field. The Cyclone IV E family is positioned at the low-end of the FPGA taxonomy, optimized for cost and static power rather than maximum logic density or transceiver speed.

Key features of the EP4CE6E22A7N include 6,272 logic elements, 270 Kbits of M9K embedded memory (30 M9K blocks), 15 embedded 18x18 multipliers, 4 user I/O banks with support for multiple I/O standards including LVDS, RSDS, mini-LVDS, LVPECL, SSTL, and HSTL, 2 general-purpose PLLs, and 10 global clock networks. The device operates from a 1.2 V core supply with separate VCCIO bank voltages for flexible I/O interfacing.

Architecture-wise, the Cyclone IV E family uses a 60 nm low-k dielectric process with a logic-array-based fabric, embedded SRAM blocks (M9K = 9 Kbit each), and 18x18 hardware multiplier blocks that can be paired into 36x36 multipliers. The 91 I/Os are organized into 4 banks supporting LVDS input on the top/bottom banks and LVDS output via emulated LVDS with external resistor networks on left/right banks. Configuration is supported through JTAG (IEEE 1149.1), Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes.

Typical applications include industrial Ethernet bridging, motor control encoder interfacing, video format conversion, LED video wall scan drivers, handheld test equipment, and low-cost custom logic replacement for ASICs. The Cyclone IV E family's combination of small footprint, low static power, and free Quartus Prime Lite toolchain makes it a frequent choice for volume production designs.

Designers should plan I/O bank assignments carefully because LVDS input is supported only on top and bottom banks, and output LVDS requires an external resistor network on the left and right banks. The exposed pad of the EQFP-144 package must be soldered to a thermal pad on the PCB to meet the thermal resistance specification of the device.

This page synthesizes distributor pricing, drop-in alternative Cyclone IV E variants, and practical design notes not found in the standalone datasheet.

Alternatif penggantian untuk EP4CE6E22A7N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EP4CE6E22A7N (sama faktor bentuk dan footprint) — berbeda di dalam Package, Process Technology, Speed Grade, Operating Temperature, Configuration Modes.

EP3C5E144A7N

Altera

Package: 144-LQFP Exposed Pad (EQFP, 22x22 mm)

Process Technology: 65 nm low-k dielectric

Speed Grade: 7