EP4CE75F29C8L vs EP4CE75F29C8N Perbandingan
Perbandingan bersamaan detil EP4CE75F29C8L dari Intel dan EP4CE75F29C8N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CE75F29C8L | EP4CE75F29C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | — |
| Device Type | FPGA (Field-Programmable Gate Array) | — |
| Logic Elements (LE) | 75,408 | 75,408 |
| Configurable Logic Blocks (CLBs) | 4,713 | — |
| Embedded Memory | 2,810,880 bits (426 Kbits M9K blocks) | — |
| Embedded Multipliers (18x18) | 426 | — |
| General-Purpose I/O Pins | 426 (max) | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Process Technology | 60 nm low-power CMOS | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Analog Voltage (VCCA) | 2.5 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Speed Grade | C8 (commercial, 8 speed bin) | — |
| Suhu Kerja | 0C to 85C (commercial) | 0C to +85C |
| Paket | FBGA-780 (FineLine BGA, 29x29 mm, 1.0 mm pitch) | 780-FBGA (29x29 mm, F29) |
| Ball Count | 780 | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | Compliant (lead-free) | Compliant |
| Configuration Scheme | AS, PS, JTAG, FPP | — |
| Series | — | Cyclone IV E |
| Number of LABs/CLBs | — | 4713 |
| Total RAM Bits | — | 2,810,880 |
| Number of I/O | — | 426 |
| Number of Logic Elements/Cells | — | 75,408 |
| Number of Gates | — | [DATA_NEEDED: gates count] |
| Voltage - Supply | — | 1.15 V to 1.25 V |
| Number of Multipliers (18x18) | — | 200 |
| Number of PLLs | — | 4 |
| Configuration Method | — | JTAG / Active Serial / Passive Serial |
| I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Process Node | — | 60 nm |