EP4CGX50DF23C7N vs EP4CGX50CF23C6N Perbandingan
Perbandingan bersamaan detil EP4CGX50DF23C7N dari Intel dan EP4CGX50CF23C6N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CGX50DF23C7N | EP4CGX50CF23C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV GX | — |
| Logic Elements | 49,888 | — |
| Configurable Logic Blocks (CLBs) | 3,118 | 3,118 |
| Total RAM Bits | 2,432 Kbit (≈ 304 KB) | — |
| Embedded 18x18 Multipliers | 66 | 132 |
| PLLs | 2 | — |
| Global Clock Networks | 8 (with up to 16 clock pins per region) | 11 |
| Number of I/O Pins | 290 | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | Up to 8 channels at 3.125 Gbps |
| Process Technology | 60 nm | 60 nm low-power CMOS |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| Suhu Kerja | 0 °C to 85 °C (commercial) | 0C to +85C (Commercial) |
| Paket | 484-ball FBGA (Plastic BGA, S-PBGA-B484, 23x23 mm) | 484-ball FineLine BGA (FBGA-484) |
| Tipe Mounting | Surface Mount | — |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | — |
| Supported Memory Interfaces | DDR2 SDRAM, QDRII SRAM, RLDRAM II | — |
| Status RoHS | Compliant (Pb-free variant) | Compliant |
| Level MSL | 3 (168 hours) | — |
| Series | — | Cyclone IV GX |
| Device Family | — | EP4CGX50 |
| Logic Elements (LE) | — | 49,888 |
| Total Memory Bits | — | 2,562,048 bits |
| Embedded Memory Blocks (M9K) | — | 56 |
| Phase-Locked Loops (PLLs) | — | 4 |
| Maximum User I/O | — | 290 |
| Core Supply Voltage | — | 1.2 V |
| Package Dimensions | — | 23 x 23 mm, 1.0 mm pitch |
| Speed Grade | — | C6 |