EP4CGX50DF23C7N vs EP4CGX50CF23C6N 비교
다음의 상세 나란히 비교: EP4CGX50DF23C7N 제조: Intel 및 EP4CGX50CF23C6N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP4CGX50DF23C7N | EP4CGX50CF23C6N |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $43.20 | $65.80 |
| Family | Cyclone IV GX | — |
| Logic Elements | 49,888 | — |
| Configurable Logic Blocks (CLBs) | 3,118 | 3,118 |
| Total RAM Bits | 2,432 Kbit (≈ 304 KB) | — |
| Embedded 18x18 Multipliers | 66 | 132 |
| PLLs | 2 | — |
| Global Clock Networks | 8 (with up to 16 clock pins per region) | 11 |
| Number of I/O Pins | 290 | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | Up to 8 channels at 3.125 Gbps |
| Process Technology | 60 nm | 60 nm low-power CMOS |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| 동작 온도 | 0 °C to 85 °C (commercial) | 0C to +85C (Commercial) |
| 패키지 | 484-ball FBGA (Plastic BGA, S-PBGA-B484, 23x23 mm) | 484-ball FineLine BGA (FBGA-484) |
| 실장 유형 | Surface Mount | — |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | — |
| Supported Memory Interfaces | DDR2 SDRAM, QDRII SRAM, RLDRAM II | — |
| RoHS 상태 | Compliant (Pb-free variant) | Compliant |
| MSL 레벨 | 3 (168 hours) | — |
| Series | — | Cyclone IV GX |
| Device Family | — | EP4CGX50 |
| Logic Elements (LE) | — | 49,888 |
| Total Memory Bits | — | 2,562,048 bits |
| Embedded Memory Blocks (M9K) | — | 56 |
| Phase-Locked Loops (PLLs) | — | 4 |
| Maximum User I/O | — | 290 |
| Core Supply Voltage | — | 1.2 V |
| Package Dimensions | — | 23 x 23 mm, 1.0 mm pitch |
| Speed Grade | — | C6 |