EP4CGX75CF23C7 vs EP4CGX110CF23C7 Perbandingan
Perbandingan bersamaan detil EP4CGX75CF23C7 dari Intel dan EP4CGX110CF23C7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CGX75CF23C7 | EP4CGX110CF23C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 73,920 | — |
| Number of Logic Gates | [DATA_NEEDED: gates] | — |
| Total Memory Bits | 4,257,792 bits | — |
| Embedded Memory | M9K blocks | 5,621,760 bits |
| Number of I/O | 290 | — |
| Number of LABs/CLBs | 4620 | — |
| Paket | 484-BGA (FBGA) | 484-ball FineLine BGA (F23) |
| Package Code | F23 | — |
| Ball Pitch | 1.0 mm | — |
| Suhu Kerja | 0C to +85C (commercial, C7 suffix) | Commercial (0C to +85C) - inferred from speed grade 'C' |
| Supply Voltage (Core) | 1.0V / 1.2V | — |
| Transceivers | 3.125 Gbps integrated | 8 channels, up to 3.125 Gbps |
| Status RoHS | Non-Compliant (Contains Lead per DigChip listing) | Compliant |
| Lead Free Status | Contains Lead (per DigChip listing) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Device Model | — | EP4CGX110 |
| Logic Elements (LEs) | — | 109,424 |
| User I/Os | — | 270 |
| Number of LABs | — | 6,839 |
| Embedded 18x18 Multipliers | — | 56 |
| PLLs | — | 4 (general purpose) |
| Core Voltage | — | 1.2 V |
| Process Technology | — | 60 nm low-power |
| Configuration Methods | — | JTAG, AS, PS, FPP |