EP4CGX75CF23C7 vs EP4CGX110CF23C7 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CGX75CF23C7 disebabkan oleh Intel dan EP4CGX110CF23C7 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CGX75CF23C7 | EP4CGX110CF23C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 73,920 | — |
| Number of Logic Gates | [DATA_NEEDED: gates] | — |
| Total Memory Bits | 4,257,792 bits | — |
| Embedded Memory | M9K blocks | 5,621,760 bits |
| Number of I/O | 290 | — |
| Number of LABs/CLBs | 4620 | — |
| Kemasan | 484-BGA (FBGA) | 484-ball FineLine BGA (F23) |
| Package Code | F23 | — |
| Ball Pitch | 1.0 mm | — |
| Suhu Operasi | 0C to +85C (commercial, C7 suffix) | Commercial (0C to +85C) - inferred from speed grade 'C' |
| Supply Voltage (Core) | 1.0V / 1.2V | — |
| Transceivers | 3.125 Gbps integrated | 8 channels, up to 3.125 Gbps |
| Status RoHS | Non-Compliant (Contains Lead per DigChip listing) | Compliant |
| Lead Free Status | Contains Lead (per DigChip listing) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Device Model | — | EP4CGX110 |
| Logic Elements (LEs) | — | 109,424 |
| User I/Os | — | 270 |
| Number of LABs | — | 6,839 |
| Embedded 18x18 Multipliers | — | 56 |
| PLLs | — | 4 (general purpose) |
| Core Voltage | — | 1.2 V |
| Process Technology | — | 60 nm low-power |
| Configuration Methods | — | JTAG, AS, PS, FPP |