EP4SGX360FF35C2XN vs EP4SGX360FF35I4N Perbandingan
Perbandingan bersamaan detil EP4SGX360FF35C2XN dari Intel dan EP4SGX360FF35I4N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4SGX360FF35C2XN | EP4SGX360FF35I4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Family | Stratix IV GX | — |
| Logic Elements | 353,600 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | — |
| Number of Logic Elements/Cells | 353,600 | — |
| Total RAM Bits | 23,105,536 | 23,105,536 |
| Number of I/O | 564 | 564 |
| User I/O Banks | 12 | — |
| Supply Voltage - Core | 0.9 V | — |
| Speed Grade | -2 | — |
| Number of Transceivers | 24 | [DATA_NEEDED: exact transceiver count per datasheet] |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| DSP Multipliers (18x18) | 1,920 (estimated per family datasheet) | — |
| Process Technology | 40 nm TSMC | 40 nm CMOS |
| Paket | 1152-BBGA, FCBGA (Flip-Chip BGA) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | 0C to +85C (Commercial) | -40C to +100C (Industrial, I4 grade) |
| Status RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Series | — | Stratix IV GX |
| Number of Logic Elements / Cells | — | 353,600 |
| Number of LABs / CLBs | — | 14,144 |
| Voltage - Supply | — | 0.9 V core |
| Paket / Case | — | 1152-BBGA, FCBGA |
| Package Dimensions | — | 35 x 35 mm |
| Supplier Device Package | — | FBGA-1152 |
| Lead Free / RoHS | — | Yes (Lead Free) |
| Clock Frequency (max) | — | 717 MHz |
| Transceiver Data Rate | — | [DATA_NEEDED: per-channel max Gbps per datasheet] |