EP4SGX360FF35C3 vs EP4SGX360FF35C2XN Perbandingan
Perbandingan bersamaan detil EP4SGX360FF35C3 dari Intel dan EP4SGX360FF35C2XN dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4SGX360FF35C3 | EP4SGX360FF35C2XN |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Series | Stratix IV GX | — |
| Family | Stratix IV GX FPGA | Stratix IV GX |
| Logic Elements (LE) | 353,600 | — |
| Logic Array Blocks (LAB) | 14,144 | — |
| Embedded Memory | 23,105,536 bits | — |
| User I/O Pins | 564 | — |
| Process Technology | 40 nm | 40 nm TSMC |
| Core Voltage | 0.9 V (0.87 V to 0.93 V) | — |
| Suhu Hubung Kerja | 0 C to 85 C | — |
| Grade | Commercial | — |
| Paket | 1152-FBGA (35x35 mm), FCBGA | 1152-BBGA, FCBGA (Flip-Chip BGA) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Speed/Package Grade | FF35 | — |
| Tipe Memori | TriMatrix (MLAB + M9K + M144K blocks) | — |
| DSP Blocks | Yes (dedicated) | — |
| Hard Memory Controller | DDR/DDR2/DDR3, QDRII+, RLDRAM II | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Logic Elements | — | 353,600 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| LABs/CLBs | — | 14,144 |
| Embedded Memory (bits) | — | 23,105,536 |
| Number of Logic Elements/Cells | — | 353,600 |
| Total RAM Bits | — | 23,105,536 |
| Number of I/O | — | 564 |
| User I/O Banks | — | 12 |
| Supply Voltage - Core | — | 0.9 V |
| Speed Grade | — | -2 |
| Number of Transceivers | — | 24 |
| Transceiver Data Rate (max) | — | 8.5 Gbps |
| DSP Multipliers (18x18) | — | 1,920 (estimated per family datasheet) |
| Suhu Kerja | — | 0C to +85C (Commercial) |