EP4SGX360FF35C3 vs EP4SGX360FF35C2XN Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX360FF35C3 disebabkan oleh Intel dan EP4SGX360FF35C2XN disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4SGX360FF35C3 | EP4SGX360FF35C2XN |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Series | Stratix IV GX | — |
| Family | Stratix IV GX FPGA | Stratix IV GX |
| Logic Elements (LE) | 353,600 | — |
| Logic Array Blocks (LAB) | 14,144 | — |
| Embedded Memory | 23,105,536 bits | — |
| User I/O Pins | 564 | — |
| Process Technology | 40 nm | 40 nm TSMC |
| Core Voltage | 0.9 V (0.87 V to 0.93 V) | — |
| Suhu Hubungan Operasi | 0 C to 85 C | — |
| Grade | Commercial | — |
| Kemasan | 1152-FBGA (35x35 mm), FCBGA | 1152-BBGA, FCBGA (Flip-Chip BGA) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Speed/Package Grade | FF35 | — |
| Jenis Ingatan | TriMatrix (MLAB + M9K + M144K blocks) | — |
| DSP Blocks | Yes (dedicated) | — |
| Hard Memory Controller | DDR/DDR2/DDR3, QDRII+, RLDRAM II | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Logic Elements | — | 353,600 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| LABs/CLBs | — | 14,144 |
| Embedded Memory (bits) | — | 23,105,536 |
| Number of Logic Elements/Cells | — | 353,600 |
| Total RAM Bits | — | 23,105,536 |
| Number of I/O | — | 564 |
| User I/O Banks | — | 12 |
| Supply Voltage - Core | — | 0.9 V |
| Speed Grade | — | -2 |
| Number of Transceivers | — | 24 |
| Transceiver Data Rate (max) | — | 8.5 Gbps |
| DSP Multipliers (18x18) | — | 1,920 (estimated per family datasheet) |
| Suhu Operasi | — | 0C to +85C (Commercial) |