EP4SGX360FF35I4N vs EP4SGX360FF35C2XN Perbandingan

Perbandingan bersamaan detil EP4SGX360FF35I4N dari Intel dan EP4SGX360FF35C2XN dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP4SGX360FF35I4N EP4SGX360FF35C2XN
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Aktif
Series Stratix IV GX —
Number of Logic Elements / Cells 353,600 —
Number of LABs / CLBs 14,144 —
Total RAM Bits 23,105,536 23,105,536
Number of I/O 564 564
Voltage - Supply 0.9 V core —
Process Technology 40 nm CMOS 40 nm TSMC
Tipe Mounting Surface Mount Surface Mount
Paket / Case 1152-BBGA, FCBGA —
Package Dimensions 35 x 35 mm —
Supplier Device Package FBGA-1152 —
Suhu Kerja -40C to +100C (Industrial, I4 grade) 0C to +85C (Commercial)
Lead Free / RoHS Yes (Lead Free) —
Clock Frequency (max) 717 MHz —
Number of Transceivers [DATA_NEEDED: exact transceiver count per datasheet] 24
Transceiver Data Rate [DATA_NEEDED: per-channel max Gbps per datasheet] —
Family — Stratix IV GX
Logic Elements — 353,600
Adaptive Logic Modules (ALMs) — [DATA_NEEDED: ALM count]
LABs/CLBs — 14,144
Embedded Memory (bits) — 23,105,536
Number of Logic Elements/Cells — 353,600
User I/O Banks — 12
Supply Voltage - Core — 0.9 V
Speed Grade — -2
Transceiver Data Rate (max) — 8.5 Gbps
DSP Multipliers (18x18) — 1,920 (estimated per family datasheet)
Paket — 1152-BBGA, FCBGA (Flip-Chip BGA)
Status RoHS — Compliant
Lead-Free — Yes

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