EP4SGX360KF40C2 vs EP4SGX360KF40C4 Perbandingan
Perbandingan bersamaan detil EP4SGX360KF40C2 dari Intel dan EP4SGX360KF40C4 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4SGX360KF40C2 | EP4SGX360KF40C4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | Stratix IV GX | Stratix IV GX |
| Process Technology | 40 nm | 40 nm CMOS |
| Logic Elements (LE) | 353,600 | — |
| Adaptive Logic Modules (ALM) | 212,160 (estimated from LE) | — |
| Embedded Memory (Bits) | 23,105,536 (17.7 Mbits M20K) | — |
| User I/O Count | 744 | — |
| Transceiver Count | Up to 24 | — |
| Max Transceiver Data Rate | 8.5 Gbps | — |
| PCIe Hard IP | PCIe Gen2 x8 (Gen1 compatible) | PCIe Gen2 x1/x4/x8 endpoints |
| DSP Blocks | 1,040 (variable precision) | — |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | C2 (commercial) | — |
| Suhu Kerja | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Paket | 1517-ball FCBGA, 42.5 x 42.5 mm | 1517-ball FC-FBGA, 1.0 mm pitch |
| Tipe Mounting | Surface Mount (flip-chip BGA) | Surface Mount |
| Level MSL | MSL3 (per JEDEC J-STD-020) | — |
| Status RoHS | Compliant | — |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Logic Elements | — | 353,600 |
| Logic Array Blocks | — | 744 LABs |
| Embedded Memory | — | 23,105,536 bits (~22.04 Mbit) |
| DSP / 18x18 Multipliers | — | 1,440 |
| Transceivers | — | 24 channels, up to 8.5 Gbps |
| PLLs | — | 12 |
| Package Code | — | FBGA-1517 |