EP4SGX360KF40C2 vs EP4SGX360KF40C4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX360KF40C2 sa pamamagitan ng Intel at EP4SGX360KF40C4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4SGX360KF40C2 | EP4SGX360KF40C4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Stratix IV GX | Stratix IV GX |
| Process Technology | 40 nm | 40 nm CMOS |
| Logic Elements (LE) | 353,600 | — |
| Adaptive Logic Modules (ALM) | 212,160 (estimated from LE) | — |
| Embedded Memory (Bits) | 23,105,536 (17.7 Mbits M20K) | — |
| User I/O Count | 744 | — |
| Transceiver Count | Up to 24 | — |
| Max Transceiver Data Rate | 8.5 Gbps | — |
| PCIe Hard IP | PCIe Gen2 x8 (Gen1 compatible) | PCIe Gen2 x1/x4/x8 endpoints |
| DSP Blocks | 1,040 (variable precision) | — |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | C2 (commercial) | — |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Packhaging | 1517-ball FCBGA, 42.5 x 42.5 mm | 1517-ball FC-FBGA, 1.0 mm pitch |
| Uri ng Pagpapasok | Surface Mount (flip-chip BGA) | Surface Mount |
| Level ng MSL | MSL3 (per JEDEC J-STD-020) | — |
| Tindminan RoHS | Compliant | — |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Logic Elements | — | 353,600 |
| Logic Array Blocks | — | 744 LABs |
| Embedded Memory | — | 23,105,536 bits (~22.04 Mbit) |
| DSP / 18x18 Multipliers | — | 1,440 |
| Transceivers | — | 24 channels, up to 8.5 Gbps |
| PLLs | — | 12 |
| Package Code | — | FBGA-1517 |