EP4SGX360KF40C2 vs EP4SGX360KF40I4N Perbandingan
Perbandingan bersamaan detil EP4SGX360KF40C2 dari Intel dan EP4SGX360KF40I4N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4SGX360KF40C2 | EP4SGX360KF40I4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix IV GX | Stratix IV GX |
| Process Technology | 40 nm | 40 nm |
| Logic Elements (LE) | 353,600 | — |
| Adaptive Logic Modules (ALM) | 212,160 (estimated from LE) | — |
| Embedded Memory (Bits) | 23,105,536 (17.7 Mbits M20K) | — |
| User I/O Count | 744 | — |
| Transceiver Count | Up to 24 | — |
| Max Transceiver Data Rate | 8.5 Gbps | — |
| PCIe Hard IP | PCIe Gen2 x8 (Gen1 compatible) | — |
| DSP Blocks | 1,040 (variable precision) | [DATA_NEEDED: number of DSP blocks and 18x18 multiplier count] |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | C2 (commercial) | — |
| Suhu Kerja | 0C to +85C (commercial) | — |
| Paket | 1517-ball FCBGA, 42.5 x 42.5 mm | 1517-BBGA, FCBGA (Flip-Chip BGA) |
| Tipe Mounting | Surface Mount (flip-chip BGA) | Surface Mount |
| Level MSL | MSL3 (per JEDEC J-STD-020) | [DATA_NEEDED: MSL moisture sensitivity level] |
| Status RoHS | Compliant | Compliant |
| Logic Elements | — | 353600 |
| Adaptive Logic Modules (ALMs) | — | 141440 |
| LABs/CLBs | — | 14144 |
| Number of I/O | — | 744 |
| Embedded Memory Bits | — | 23105536 |
| Package Pin/Ball Count | — | 1517 |
| Operating Temperature Grade | — | Industrial (I4 suffix) |
| Lead Free | — | Yes |
| Transceivers | — | [DATA_NEEDED: number of embedded transceivers and max data rate] |