EPF10K100BFC256-3 vs EPF10K100EFC256-3 Perbandingan
Perbandingan bersamaan detil EPF10K100BFC256-3 dari Intel dan EPF10K100EFC256-3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EPF10K100BFC256-3 | EPF10K100EFC256-3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Typical Gates | 100,000 | — |
| Logic Elements (LEs) | 4,992 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| Total RAM Bits | 24,576 | — |
| Maximum Operating Frequency | 200 MHz | — |
| Process Technology | 0.22 µm CMOS SRAM | 0.22 micron CMOS |
| Core Supply Voltage | 2.5 V (range 2.3 V to 2.7 V) | 2.5 V |
| Speed Grade | -3 | -3 (faster) |
| Paket | 256-pin FineLine BGA (FBGA) | 256-ball FBGA (FineLine BGA) |
| User I/O Pins (max) | [DATA_NEEDED: exact user I/O count for BFC256 package] | — |
| Rentang Suhu Kerja | 0 °C to 70 °C | — |
| Configuration Method | SRAM, requires external config device | — |
| JTAG Boundary Scan | IEEE Std. 1149.1-1990 compliant | — |
| PCI Compliance | PCI Local Bus Spec Rev. 2.2 (3.3 V, -3 speed grade) | PCI Local Bus Specification Rev 2.2 at 33/66 MHz |
| Tipe Mounting | Surface Mount (BGA) | — |
| Level MSL | [DATA_NEEDED: MSL rating] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Logic Elements | — | 4,992 |
| System Gates | — | 100,000 (typical) |
| Embedded RAM Bits | — | 49,152 bits |
| Maximum User I/Os | — | 191 |
| Logic Array Blocks (LABs) | — | 624 |
| Maximum Internal Frequency | — | 200 MHz |
| Propagation Delay | — | 0.6 ns |
| I/O Supply Voltage | — | 3.3 V |
| Logic Family | — | CMOS |
| Suhu Kerja | — | 0C to +70C (commercial) |
| JTAG Support | — | IEEE 1149.1-1990 compliant |