EPM570F256C3N vs EPM570F256C5NRR Perbandingan
Perbandingan bersamaan detil EPM570F256C3N dari Intel dan EPM570F256C5NRR dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EPM570F256C3N | EPM570F256C5NRR |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | MAX II (CPLD) |
| Logic Elements (LEs) | 570 | — |
| Equivalent Macrocells | 440 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbytes |
| Maximum Operating Frequency | 304 MHz | — |
| Process Technology | 0.18 um, 6-layer-metal flash CMOS | 0.18 µm flash CMOS |
| Core Voltage | 2.5 V / 3.3 V | — |
| I/O Voltage Support (MultiVolt) | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| Paket | 256-ball FBGA (FineLine BGA) | 256-ball FBGA (FineLine BGA) |
| User I/O Count | [DATA_NEEDED: confirm exact user-IO count for F256 package] | — |
| Operating Temperature (C3 grade) | 0 C to +85 C (commercial) | — |
| Programming Interface | JTAG (IEEE 1532 / IEEE 1149.1) + ISP | JTAG (IEEE 1149.1), in-system programmable |
| Tipe Mounting | Surface Mount | Surface Mount |
| Level MSL | [DATA_NEEDED: MSL level not stated in provided data] | — |
| Status RoHS | Compliant (per DigiKey listing) | Compliant |
| Lead-Free | Yes (per suffix 'N' convention) | — |
| Typical Macroscopic Functions | Glue logic, bus bridging, I/O expansion, power sequencing | — |
| Series | — | MAX II |
| Logic Elements | — | 570 |
| Macro Cells | — | 440 |
| Pin-to-Pin Delay (tPD) | — | 8.7 ns (C5 speed grade) |
| Internal fMAX | — | 201.1 MHz |
| Maximum User I/O Pins | — | 212 (typical, 256-BGA) |
| Operating Supply Voltage - Core (VCCINT) | — | 2.5 V (3.3 V tolerant) |
| Operating Supply Voltage - I/O (VCCIO) | — | 2.5 V or 3.3 V |
| Suhu Kerja | — | 0 °C to +85 °C (commercial, C-speed grade) |
| Configuration Memory | — | On-chip non-volatile flash |