EPM570F256C4N vs EPM570GF256C4N Perbandingan

Perbandingan bersamaan detil EPM570F256C4N dari Intel dan EPM570GF256C4N dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EPM570F256C4N EPM570GF256C4N
Merek Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Series MAX II —
Logic Elements 570 LE —
Macrocells 440 440
Logic Array Blocks (LABs) 57 —
User I/O Count 160 —
User Flash Memory (UFM) 8 Kbit 8 Kbits
Paket 256-ball FineLine BGA (FBGA) 256-ball FineLine BGA (FBGA-256)
Package Size 17 mm × 17 mm —
Process Technology 0.18 µm 6-layer-metal flash —
Maximum Internal Frequency 304 MHz —
Pin-to-Pin Logic Delay 5.4 ns —
Operating Supply Voltage (VCCINT) 2.5 V, 3.3 V —
MultiVolt I/O Voltages 1.5 V, 1.8 V, 2.5 V, 3.3 V —
Rentang Suhu Kerja 0 °C to +70 °C (commercial) —
In-System Programmability (ISP) Yes (JTAG) —
Tipe Mounting Surface Mount Surface Mount (BGA)
Status RoHS Compliant —
Family — MAX II G
Device Series — EPM570G
Logic Elements (LEs) — 570
User I/Os — 212
Speed Grade — C4 (tPD = 4 ns)
Pin-to-Pin Delay (tPD) — 4 ns
Internal fMAX — 304 MHz
Ball Pitch — 1.0 mm
Package Dimensions — 17 x 17 mm
Core Voltage — 1.8 V
I/O Bank Voltages (MultiVolt) — 1.5 V / 1.8 V / 2.5 V / 3.3 V
Suhu Kerja — -40 °C to +125 °C (industrial)
Configuration Memory — Flash (non-volatile, instant-on)
Programming Interface — JTAG (IEEE 1149.1), in-system programmable
Lead-Free / RoHS — Lead-free, FBGA package

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