EPM570F256C4N vs EPM570GF256C4N 比較

詳細並排比較 EPM570F256C4N 由 Intel 與 EPM570GF256C4N 由 Altera. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EPM570F256C4N EPM570GF256C4N
品牌 Intel Altera
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Series MAX II —
Logic Elements 570 LE —
Macrocells 440 440
Logic Array Blocks (LABs) 57 —
User I/O Count 160 —
User Flash Memory (UFM) 8 Kbit 8 Kbits
封裝 256-ball FineLine BGA (FBGA) 256-ball FineLine BGA (FBGA-256)
Package Size 17 mm × 17 mm —
Process Technology 0.18 µm 6-layer-metal flash —
Maximum Internal Frequency 304 MHz —
Pin-to-Pin Logic Delay 5.4 ns —
Operating Supply Voltage (VCCINT) 2.5 V, 3.3 V —
MultiVolt I/O Voltages 1.5 V, 1.8 V, 2.5 V, 3.3 V —
工作溫度範圍 0 °C to +70 °C (commercial) —
In-System Programmability (ISP) Yes (JTAG) —
安裝類型 Surface Mount Surface Mount (BGA)
RoHS 狀態 Compliant —
Family — MAX II G
Device Series — EPM570G
Logic Elements (LEs) — 570
User I/Os — 212
Speed Grade — C4 (tPD = 4 ns)
Pin-to-Pin Delay (tPD) — 4 ns
Internal fMAX — 304 MHz
Ball Pitch — 1.0 mm
Package Dimensions — 17 x 17 mm
Core Voltage — 1.8 V
I/O Bank Voltages (MultiVolt) — 1.5 V / 1.8 V / 2.5 V / 3.3 V
工作溫度 — -40 °C to +125 °C (industrial)
Configuration Memory — Flash (non-volatile, instant-on)
Programming Interface — JTAG (IEEE 1149.1), in-system programmable
Lead-Free / RoHS — Lead-free, FBGA package

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