EPM570GF256C3 vs EPM570GF256C4N Perbandingan
Perbandingan bersamaan detil EPM570GF256C3 dari Altera dan EPM570GF256C4N dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Altera
EPM570GF256C4N - 570 LEs CPLD, 4ns, 212 I/O, FBGA-256 | Intel / Altera
EPM570GF256C4N ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | EPM570GF256C3 | EPM570GF256C4N |
|---|---|---|
| Merek | Altera | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | MAX II G |
| Device Model | EPM570 | — |
| Logic Elements (LE) | 570 | — |
| Equivalent Macrocells | 440 | — |
| User I/Os (max, FBGA-256) | 212 | — |
| User Flash Memory (UFM) | 8 Kbit | 8 Kbits |
| Propagation Delay tPD1 | 8.7 ns (C3 speed grade) | — |
| Internal Performance fMAX | 300 MHz | — |
| Process Technology | 0.18 um 6-layer-metal flash | — |
| Supply Voltage VCCINT | 1.8 V (core, MultiVolt) | — |
| I/O Bank Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) | — |
| Paket | FBGA-256 (FineLine BGA), 17 x 17 mm, 1.0 mm pitch, lead-free | 256-ball FineLine BGA (FBGA-256) |
| Operating Temperature (commercial) | -40 C to +125 C per 3rd-party spec (Altera commercial: 0 C to +85 C) | — |
| Programming Interface | JTAG (IEEE 1149.1) / ISP | JTAG (IEEE 1149.1), in-system programmable |
| Status RoHS | Compliant (lead-free) | — |
| Level MSL | 3 (per JEDEC J-STD-020, typical for FBGA) | — |
| Vertical Migration Within FBGA-256 | Supported across EPM570 / EPM1270 / EPM2210 | — |
| Device Series | — | EPM570G |
| Logic Elements (LEs) | — | 570 |
| Macrocells | — | 440 |
| User I/Os | — | 212 |
| Speed Grade | — | C4 (tPD = 4 ns) |
| Pin-to-Pin Delay (tPD) | — | 4 ns |
| Internal fMAX | — | 304 MHz |
| Ball Pitch | — | 1.0 mm |
| Package Dimensions | — | 17 x 17 mm |
| Core Voltage | — | 1.8 V |
| I/O Bank Voltages (MultiVolt) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Suhu Kerja | — | -40 °C to +125 °C (industrial) |
| Configuration Memory | — | Flash (non-volatile, instant-on) |
| Lead-Free / RoHS | — | Lead-free, FBGA package |
| Tipe Mounting | — | Surface Mount (BGA) |