EPM570GF256C3 vs EPM570GF256C4N Karşılaştırma
Ayrıntılı yan yana karşılaştırma EPM570GF256C3 tarafından Altera ve EPM570GF256C4N tarafından AlteraAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Altera
EPM570GF256C4N - 570 LEs CPLD, 4ns, 212 I/O, FBGA-256 | Intel / Altera
EPM570GF256C4N ✓ AktifÖzellik Karşılaştırması
| Parametre | EPM570GF256C3 | EPM570GF256C4N |
|---|---|---|
| Marka | Altera | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Aktif | Aktif |
| Family | MAX II | MAX II G |
| Device Model | EPM570 | — |
| Logic Elements (LE) | 570 | — |
| Equivalent Macrocells | 440 | — |
| User I/Os (max, FBGA-256) | 212 | — |
| User Flash Memory (UFM) | 8 Kbit | 8 Kbits |
| Propagation Delay tPD1 | 8.7 ns (C3 speed grade) | — |
| Internal Performance fMAX | 300 MHz | — |
| Process Technology | 0.18 um 6-layer-metal flash | — |
| Supply Voltage VCCINT | 1.8 V (core, MultiVolt) | — |
| I/O Bank Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) | — |
| Paket | FBGA-256 (FineLine BGA), 17 x 17 mm, 1.0 mm pitch, lead-free | 256-ball FineLine BGA (FBGA-256) |
| Operating Temperature (commercial) | -40 C to +125 C per 3rd-party spec (Altera commercial: 0 C to +85 C) | — |
| Programming Interface | JTAG (IEEE 1149.1) / ISP | JTAG (IEEE 1149.1), in-system programmable |
| RoHS Durumu | Compliant (lead-free) | — |
| MSL Seviyesi | 3 (per JEDEC J-STD-020, typical for FBGA) | — |
| Vertical Migration Within FBGA-256 | Supported across EPM570 / EPM1270 / EPM2210 | — |
| Device Series | — | EPM570G |
| Logic Elements (LEs) | — | 570 |
| Macrocells | — | 440 |
| User I/Os | — | 212 |
| Speed Grade | — | C4 (tPD = 4 ns) |
| Pin-to-Pin Delay (tPD) | — | 4 ns |
| Internal fMAX | — | 304 MHz |
| Ball Pitch | — | 1.0 mm |
| Package Dimensions | — | 17 x 17 mm |
| Core Voltage | — | 1.8 V |
| I/O Bank Voltages (MultiVolt) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| İşletim Sıcaklığı | — | -40 °C to +125 °C (industrial) |
| Configuration Memory | — | Flash (non-volatile, instant-on) |
| Lead-Free / RoHS | — | Lead-free, FBGA package |
| Montaj Türü | — | Surface Mount (BGA) |