H5AN4G6NBJR-VKC vs H5AN4G6NBJR-UHC Perbandingan
Perbandingan bersamaan detil H5AN4G6NBJR-VKC dari SK hynix dan H5AN4G6NBJR-UHC dari SK hynix. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | H5AN4G6NBJR-VKC | H5AN4G6NBJR-UHC |
|---|---|---|
| Merek | SK hynix | SK hynix |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | DDR4 SDRAM | DDR4 SDRAM |
| Ukuran Memori | 4 Gbit | 4 Gbit |
| Memory Organization | 256M x 16 | — |
| Laju Data | 2666 Mbps | — |
| Clock Frequency | 1.6 GHz (internal reference per distributor data) | 1.6 GHz |
| Supply Voltage (VDD) | 1.2 V nominal (1.14 V to 1.26 V) | 1.14 V to 1.26 V |
| Operating Current | 38 mA (typical, per distributor data) | — |
| Antarmuka | Parallel | — |
| Technology | CMOS | CMOS |
| Suhu Kerja | -40C to +95C | -40C to +95C |
| Paket | FBGA-96 / TFBGA (PBGA96) | FBGA-96 (PBGA-96) |
| Body Size | 13 mm, 1.2 mm profile, 0.8 mm ball pitch | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Termination | Dynamic on-chip termination (ODT) | — |
| Calibration | ZQ calibration; write leveling | — |
| Protection Functions | Asynchronous reset; CRC; data mask | — |
| Refresh | Auto self-refresh | — |
| Status RoHS | Compliant | Compliant |
| Packaging | Tray | — |
| Organisasi | — | 256M x 16 |
| Self Refresh | — | Auto self-refresh |
| Data Mask Function | — | Yes (DM) |
| Asynchronous Reset | — | Yes (RESET_n) |
| On-Die Termination | — | Dynamic ODT |
| ZQ Calibration | — | Yes |
| Write Leveling | — | Yes |
| CRC Function | — | Yes (command/address CRC) |