H5ANAG6NCR-RDC vs H5ANAG6NBJR-RDC Perbandingan
Perbandingan bersamaan detil H5ANAG6NCR-RDC dari SK hynix dan H5ANAG6NBJR-RDC dari SK hynix. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | H5ANAG6NCR-RDC | H5ANAG6NBJR-RDC |
|---|---|---|
| Merek | SK hynix | SK hynix |
| Kategori | Memory ICs | DRAM |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | DDR4 SDRAM | DDR4 SDRAM |
| Ukuran Memori | 16 Gb (2 GB) | — |
| Organisasi | 1G x 16 | — |
| Laju Data | 3200 Mbps (PC4-25600 class) | 2666 Mbps (speed grade -RDC) |
| Supply Voltage (VDD) | 1.2 V | 1.2 V |
| Paket | 96-ball FBGA | FBGA (Ball Grid Array), surface mount |
| Package Body | Rectangular, 8 mm width | — |
| Maximum Standby Current | 0.074 A | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Number of Terminals (Balls) | 96 | — |
| Auto Self-Refresh | Yes | — |
| Auto Precharge | Yes | — |
| Asynchronous Reset | Yes | — |
| Data Mask (DM) Function | Yes | — |
| Dynamic On-Chip Termination (ODT) | Yes | — |
| ZQ Calibration | Yes | — |
| CRC Function | Yes | — |
| Write Leveling | Yes | — |
| Status RoHS | [DATA_NEEDED: RoHS Status] | [DATA_NEEDED: RoHS Status] |
| Suhu Kerja | [DATA_NEEDED: Operating Temperature Range] | [DATA_NEEDED: Operating Temperature Range] |
| Refresh Interval | [DATA_NEEDED: Refresh Interval] | — |
| Memory Organization | — | 16Gb x16 |
| Density | — | 16 Gb |
| Antarmuka | — | Synchronous, double data rate |
| Clocking | — | Fully synchronous to both clock edges |
| Technology | — | CMOS |
| Standard | — | JEDEC DDR4 SDRAM |
| Application | — | Main memory |
| On-Die Termination (ODT) | — | Supported (DDR4 feature) |
| Bank Group Architecture | — | DDR4 bank groups (per JEDEC DDR4) |