K4A8G085WC-BCTD vs K4A8G085WB Perbandingan
Perbandingan bersamaan detil K4A8G085WC-BCTD dari Samsung Electronics dan K4A8G085WB dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Samsung Electronics
K4A8G085WC-BCTD - 8Gb DDR4 SDRAM 2666Mbps 1.2V | Samsung
K4A8G085WC-BCTD ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | K4A8G085WC-BCTD | K4A8G085WB |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Aktif |
| Tipe Memori | DDR4 SDRAM | DDR4 SDRAM (B-die) |
| Density | 8 Gb | 8 Gbit |
| Organisasi | 1G x 8 | 1G x 8 |
| Laju Data | 2666 Mbps (PC4-2133) | [DATA_NEEDED: speed grade data rate in Mbps] |
| Supply Voltage (VDD/VDDQ) | 1.2 V (1.14 V to 1.26 V) | — |
| Paket | 78-ball FBGA (78FBGA) | 78-pin FBGA |
| Ball Pitch | 0.8 mm | — |
| Suhu Kerja | 0C to +95C | [DATA_NEEDED: operating temperature range] |
| Standard Operating Temp Range | 0C to +85C | — |
| Burst Length | 8 (chop 4) | — |
| Auto Precharge | Yes | — |
| Asynchronous Reset | Yes | — |
| CRC Function | Yes | — |
| ZQ Calibration | Yes | — |
| Dynamic ODT | Yes | — |
| Data Mask | Yes | — |
| Tipe Antarmuka | Synchronous, parallel | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Tegangan Pemuat | — | 1.2 V |
| Operating Mode | — | DLL Enabled mode (per datasheet) |
| Speed Grade Suffixes | — | -BCRC, -BIRC, -BCTD, -BCPB (per family naming) |
| tCL/cas latency | — | [DATA_NEEDED: CAS latency] |
| Refresh | — | [DATA_NEEDED: refresh rate 1x/2x] |
| Bank Groups | — | [DATA_NEEDED: bank/bank group count] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| Level MSL | — | [DATA_NEEDED: moisture sensitivity level] |
| Termination Voltage (VTT) | — | [DATA_NEEDED: VTT value] |