K4B4G1646D-BHMA vs K4B4G1646D-BFMA Perbandingan
Perbandingan bersamaan detil K4B4G1646D-BHMA dari Samsung Electronics dan K4B4G1646D-BFMA dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | K4B4G1646D-BHMA | K4B4G1646D-BFMA |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | DDR3L SDRAM | DDR3 SDRAM |
| Density | 4 Gb | 4Gb |
| Organisasi | 256M x 16 | 256M x 16 |
| Laju Data | 1866 Mbps | 1866 Mbps |
| Tegangan Pemuat | 1.35 V (1.283 V to 1.45 V) | 1.5V |
| Paket | 96-ball FBGA | 96-ball FBGA |
| Suhu Kerja | -40°C to +95°C (TC) | — |
| Latensi CAS | 13 (at 1866 Mbps) | Programmable |
| Burst Length | 8 and 4 | 8 and 4 (with burst chop) |
| Number of Terminals | 96 | — |
| Lead-Free | Yes | Yes |
| Bebas Halogen | Yes | Yes |
| RoHS Compliant | Yes | — |
| Die Version | D-die | — |
| Refresh Mode | Auto and Self Refresh | — |
| Ball Pitch | — | 0.8mm |
| Number of Banks | — | 8 |
| On-Die Termination | — | Yes |
| Temperature Range | — | 0°C to 95°C (case) |
| RoHS | — | Compliant |