K4B4G1646D-BHMA - 4Gb DDR3L SDRAM 256Mx16 | Samsung
MPN: K4B4G1646D-BHMA ✓ AktifK4B4G1646D-BHMA Ringkasan
DDR3L SDRAM (Double Data Rate 3 Low Voltage) is a type of synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption while maintaining high bandwidth. It is part of the DDR3 memory family, which uses double data rate signaling to transfer data on both edges of the clock, achieving high data rates. DDR3L is commonly used in mobile devices, embedded systems, and servers where power efficiency is critical.
Key features include a 4Gb density, 256M x 16 organization, 1866 Mbps data rate, and 1.35V operation. The device supports on-die termination (ODT), programmable CAS latency, and burst lengths of 8 and 4. It also features auto refresh and self refresh modes, and is compatible with JEDEC DDR3L standards. The 96-ball FBGA package provides a compact footprint suitable for space-constrained designs.
Technically, the K4B4G1646D-BHMA uses a D-die process, which offers improved performance and power characteristics compared to earlier dies. It supports DLL (Delay-Locked Loop) enabled mode for precise timing, and includes features like write leveling and read leveling for signal integrity. The device operates over a temperature range of -40°C to +95°C (TC), making it suitable for industrial applications.
Typical applications include personal computing devices, mobile phones, tablets, digital cameras, printers, networking equipment, industrial machinery, medical devices, automotive electronics, and solid-state drives. Its low voltage and high density make it ideal for power-sensitive portable devices and high-performance computing platforms.
When designing with this device, ensure proper decoupling capacitors near the power pins and follow the PCB layout guidelines in the datasheet to maintain signal integrity at 1866 Mbps. Also, verify the timing parameters for your specific application, as DDR3L timing is critical for reliable operation.
Alternatif penggantian untuk K4B4G1646D-BHMA — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian K4B4G1646D-BHMA (sama faktor bentuk dan footprint) — berbeda di dalam Package, Data Rate, Operating Temperature, Supply Voltage, CAS Latency.
K4B4G1646E-BMK0
✅ Drop-InKontak untuk harga
Lihat Datasheet →K4B4G1646D-BMK0
✅ Drop-InKontak untuk harga
Lihat Datasheet →K4B4G1646D-BPH90
✅ Drop-InKontak untuk harga
Lihat Datasheet →K4B4G1646D-BFMA
✅ Drop-InKontak untuk harga
Lihat Datasheet →K4B4G1646E-BYMA
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan✗ Habis Stok
$14.3182 / Satuan
Lihat Datasheet →MT41K256M16HA-125
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan✗ Habis Stok
$6.3636 / Satuan
Lihat Datasheet →H5TC4G63AFR-PBA
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan✗ Habis Stok
$3.9773 / Satuan
Lihat Datasheet →IS43TR16256AL-125KBL
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →K4B4G1646D-BHMA Rating Maksimal & Karakteristik Listrik
| Tipe Memori | DDR3L SDRAM |
| Density | 4 Gb |
| Organisasi | 256M x 16 |
| Laju Data | 1866 Mbps |
| Tegangan Pemuat | 1.35 V (1.283 V to 1.45 V) |
| Paket | 96-ball FBGA |
| Suhu Kerja | -40°C to +95°C (TC) |
| Latensi CAS | 13 (at 1866 Mbps) |
| Burst Length | 8 and 4 |
| Number of Terminals | 96 |
| Lead-Free | Yes |
| Bebas Halogen | Yes |
| RoHS Compliant | Yes |
| Die Version | D-die |
| Refresh Mode | Auto and Self Refresh |
Konfigurasi Pin K4B4G1646D-BHMA
| Pin produk A1 | VDD — Power supply |
| Pin produk A2 | DQ0 — Data input/output 0 |
| Pin produk A3 | DQ1 — Data input/output 1 |
| Pin produk A4 | VSS — Ground |
| Pin produk A5 | DQ2 — Data input/output 2 |
| Pin produk A6 | DQ3 — Data input/output 3 |
| Pin produk A7 | VDD — Power supply |
| Pin produk A8 | DQ4 — Data input/output 4 |
| Pin produk A9 | DQ5 — Data input/output 5 |
| Pin produk A10 | VSS — Ground |
| Pin produk A11 | DQ6 — Data input/output 6 |
| Pin produk A12 | DQ7 — Data input/output 7 |
| Pin produk B1 | VSS — Ground |
| Pin produk B2 | DQ8 — Data input/output 8 |
| Pin produk B3 | DQ9 — Data input/output 9 |
| Pin produk B4 | VDD — Power supply |
| Pin produk B5 | DQ10 — Data input/output 10 |
| Pin produk B6 | DQ11 — Data input/output 11 |
| Pin produk B7 | VSS — Ground |
| Pin produk B8 | DQ12 — Data input/output 12 |
| Pin produk B9 | DQ13 — Data input/output 13 |
| Pin produk B10 | VDD — Power supply |
| Pin produk B11 | DQ14 — Data input/output 14 |
| Pin produk B12 | DQ15 — Data input/output 15 |
| Pin produk C1 | VDDQ — DQ power supply |
| Pin produk C2 | VSSQ — DQ ground |
| Pin produk C3 | VDDQ — DQ power supply |
| Pin produk C4 | VSSQ — DQ ground |
| Pin produk C5 | VDDQ — DQ power supply |
| Pin produk C6 | VSSQ — DQ ground |
| Pin produk C7 | VDDQ — DQ power supply |
| Pin produk C8 | VSSQ — DQ ground |
| Pin produk C9 | VDDQ — DQ power supply |
| Pin produk C10 | VSSQ — DQ ground |
| Pin produk C11 | VDDQ — DQ power supply |
| Pin produk C12 | VSSQ — DQ ground |
| Pin produk D1 | A0 — Address input 0 |
| Pin produk D2 | A1 — Address input 1 |
| Pin produk D3 | A2 — Address input 2 |
| Pin produk D4 | A3 — Address input 3 |
| Pin produk D5 | A4 — Address input 4 |
| Pin produk D6 | A5 — Address input 5 |
| Pin produk D7 | A6 — Address input 6 |
| Pin produk D8 | A7 — Address input 7 |
| Pin produk D9 | A8 — Address input 8 |
| Pin produk D10 | A9 — Address input 9 |
| Pin produk D11 | A10/AP — Address input 10 / Auto-precharge |
| Pin produk D12 | A11 — Address input 11 |
| Pin produk E1 | A12 — Address input 12 |
| Pin produk E2 | A13 — Address input 13 |
| Pin produk E3 | A14 — Address input 14 |
| Pin produk E4 | BA0 — Bank address 0 |
| Pin produk E5 | BA1 — Bank address 1 |
| Pin produk E6 | BA2 — Bank address 2 |
| Pin produk E7 | RAS# — Row address strobe |
| Pin produk E8 | CAS# — Column address strobe |
| Pin produk E9 | WE# — Write enable |
| Pin produk E10 | CS# — Chip select |
| Pin produk E11 | CKE — Clock enable |
| Pin produk E12 | ODT — On-die termination |
| Pin produk F1 | CK — Clock positive |
| Pin produk F2 | CK# — Clock negative |
| Pin produk F3 | VDD — Power supply |
| Pin produk F4 | VSS — Ground |
| Pin produk F5 | VDD — Power supply |
| Pin produk F6 | VSS — Ground |
| Pin produk F7 | VDD — Power supply |
| Pin produk F8 | VSS — Ground |
| Pin produk F9 | VDD — Power supply |
| Pin produk F10 | VSS — Ground |
| Pin produk F11 | VDD — Power supply |
| Pin produk F12 | VSS — Ground |
| Pin produk G1 | DM0 — Data mask 0 |
| Pin produk G2 | DM1 — Data mask 1 |
| Pin produk G3 | DQS0 — Data strobe 0 |
| Pin produk G4 | DQS0# — Data strobe 0 complement |
| Pin produk G5 | DQS1 — Data strobe 1 |
| Pin produk G6 | DQS1# — Data strobe 1 complement |
| Pin produk G7 | DQS2 — Data strobe 2 |
| Pin produk G8 | DQS2# — Data strobe 2 complement |
| Pin produk G9 | DQS3 — Data strobe 3 |
| Pin produk G10 | DQS3# — Data strobe 3 complement |
| Pin produk G11 | VDD — Power supply |
| Pin produk G12 | VSS — Ground |
| Pin produk H1 | VSS — Ground |
| Pin produk H2 | VDD — Power supply |
| Pin produk H3 | VSS — Ground |
| Pin produk H4 | VDD — Power supply |
| Pin produk H5 | VSS — Ground |
| Pin produk H6 | VDD — Power supply |
| Pin produk H7 | VSS — Ground |
| Pin produk H8 | VDD — Power supply |
| Pin produk H9 | VSS — Ground |
| Pin produk H10 | VDD — Power supply |
| Pin produk H11 | VSS — Ground |
| Pin produk H12 | VDD — Power supply |
Aplikasi Umum
K4B4G1646D-BHMA cocok untuk 6 aplikasis: Embedded Systems, Networking Equipment, Mobile Devices, Industrial Machinery, Medical Devices, Automotive Electronics.
Embedded Systems
The K4B4G1646D-BHMA is ideal for embedded systems requiring high-density, low-power memory. Its 4Gb density and 1.35V operation reduce power consumption, making it suitable for industrial controllers, IoT gateways, and single-board computers. The 1866 Mbps data rate ensures fast data processing, while the 96FBGA package fits compact PCB designs. According to Samsung, it is designed for high-density memory applications in embedded systems.
Direkomendasikan
Networking Equipment
In networking equipment such as routers, switches, and firewalls, the K4B4G1646D-BHMA provides high-bandwidth memory for packet buffering and routing tables. Its 1866 Mbps data rate supports high-throughput data processing, and the 1.35V operation reduces power in always-on network devices. The 96FBGA package allows for dense memory arrays on network line cards. According to Samsung, it is suitable for networking equipment.
Direkomendasikan
Mobile Devices
The K4B4G1646D-BHMA is well-suited for mobile devices like smartphones and tablets due to its low 1.35V operation, which extends battery life. The 4Gb density provides ample memory for multitasking and multimedia applications. The 1866 Mbps data rate ensures smooth performance for apps and games. Its compact 96FBGA package is ideal for space-constrained mobile PCBs. According to Samsung, it is used in mobile phones and tablets.
Direkomendasikan
Industrial Machinery
The K4B4G1646D-BHMA operates over -40°C to +95°C, making it suitable for industrial machinery that experiences extreme temperatures. Its high density and 1866 Mbps data rate support real-time control and data logging. The 1.35V operation reduces power in industrial systems. The 96FBGA package provides reliable solder joints for harsh environments. According to Samsung, it is used in industrial machinery.
Direkomendasikan
Medical Devices
In medical devices such as patient monitors and diagnostic equipment, the K4B4G1646D-BHMA provides reliable, high-density memory for data acquisition and processing. Its low 1.35V operation is critical for battery-powered portable medical devices. The 1866 Mbps data rate supports real-time signal processing. The 96FBGA package is compact for medical device PCBs. According to Samsung, it is used in medical devices.
Direkomendasikan
Automotive Electronics
The K4B4G1646D-BHMA is suitable for automotive electronics such as infotainment systems and ADAS, where high-density memory and low power are essential. Its wide temperature range (-40°C to +95°C) meets automotive requirements. The 1866 Mbps data rate supports high-bandwidth applications like navigation and camera processing. The 96FBGA package is robust for automotive environments. According to Samsung, it is used in automotive electronics.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk K4B4G1646D-BHMA — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | K4B4G1646E-BMK0 | K4B4G1646D-BMK0 | MT41K256M16HA-125 |
|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Micron Technology |
| Density | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Data Rate | 1866 Mbps | 1866 Mbps | 1866 Mbps | 1866 Mbps |
| Supply Voltage | 1.35 V | 1.35 V | 1.35 V | 1.35 V |
| Operating Temperature | -40°C to +95°C | -40°C to +95°C | -40°C to +95°C | -40°C to +95°C |
Diferensiator Kunci
- D-die process for improved performance (vsK4B4G1646E-BMK0)
- Low voltage operation at 1.35V (vsMT41K256M16HA-125)
- Wide temperature range (vsIS43TR16256AL-125KBL)
Catatan Desain
For reliable operation at 1866 Mbps, follow the PCB layout guidelines in the Samsung datasheet. Ensure proper impedance matching for DQ, DQS, and address/control lines. Use 40-60 ohm single-ended and 80-120 ohm differential impedance. Keep trace lengths matched within 50 mils for DQ/DQS groups. Place decoupling capacitors (0.1uF and 1uF) close to VDD and VDDQ pins to minimize power supply noise.
The K4B4G1646D-BHMA operates at 1.35V, which is lower than standard DDR3 (1.5V). Ensure the power supply can provide adequate current during burst operations. Use a dedicated voltage regulator with low output noise and fast transient response. According to the datasheet, the supply voltage range is 1.283V to 1.45V. Monitor the power supply for droop during high-speed switching.
The K4B4G1646D-BHMA operates over -40°C to +95°C. For high-density memory arrays, ensure adequate airflow or heatsinking to keep the junction temperature within limits. The 96FBGA package has a thermal resistance that depends on PCB copper area. Use thermal vias under the package to improve heat dissipation. According to Samsung, the device is suitable for industrial temperature ranges.
Informasi Konformitas
Lead-free and halogen-free per datasheet. RoHS compliant. AEC-Q100 not applicable for memory ICs.
