K4B4G1646D-BYK0 vs K4B4G1646E-BYK000 Perbandingan
Perbandingan bersamaan detil K4B4G1646D-BYK0 dari Samsung Electronics dan K4B4G1646E-BYK000 dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | K4B4G1646D-BYK0 | K4B4G1646E-BYK000 |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | DDR3L SDRAM | DDR3L SDRAM |
| Density | 4 Gbit | — |
| Organisasi | 256M x 16 | 256M x 16 |
| Tegangan Pemuat | 1.35 V (1.5 V compatible) | — |
| Laju Data | 1600 Mbps (PC3-12800) | — |
| Paket | 96-ball FBGA | 96-FBGA (BYK) |
| Suhu Kerja | 0°C to 85°C | [DATA_NEEDED: operating temperature range] |
| Latensi CAS | Programmable (e.g., 11, 10, 9) | — |
| Burst Length | 8 (with burst chop 4) | — |
| On-Die Termination | Yes | — |
| Lead-Free | Yes | — |
| Bebas Halogen | Yes | — |
| RoHS Compliant | Yes | — |
| Jumlah Pin | 96 | — |
| Die Revision | D-die | — |
| Ukuran Memori | — | 4 Gbit |
| Speed Grade | — | DDR3-1600 (1.25 ns clock cycle) |
| Clock Frequency | — | 800 MHz |
| CAS Latency (CL) | — | [DATA_NEEDED: CAS latency - 1.25 ns CL grade indicates CL11 but not explicitly stated in provided data] |
| Supply Voltage (VDD) | — | 1.35 V (DDR3L), 1.5 V compatible (DDR3) |
| Number of Banks | — | [DATA_NEEDED: bank count] |
| Die Process | — | Samsung E-die |
| Tipe Mounting | — | Surface Mount |
| Antarmuka | — | Parallel |
| Fitur | — | Auto precharge, asynchronous reset, ZQ calibration, dynamic on-chip termination, data mask |
| Status RoHS | — | [DATA_NEEDED: RoHS status] |
| Access Time | — | 1.25 ns |