M1AFS250-1FGG256I vs M1AFS250-1FG256 Perbandingan
Perbandingan bersamaan detil M1AFS250-1FGG256I dari Microchip Technology dan M1AFS250-1FG256 dari Microchip Technology. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Microchip Technology
M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip
M1AFS250-1FGG256I ✓ AktifMicrochip Technology
M1AFS250-1FG256 - 250K Gate Fusion FPGA, ARM Cortex-M1 | Microchip
M1AFS250-1FG256 ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | M1AFS250-1FGG256I | M1AFS250-1FG256 |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | M1AFS250 (Fusion) | — |
| System Gates | 250,000 gates | 250000 gates |
| Logic Cells | 6144 | — |
| Total SRAM/Flip-Flop Bits (DigiKey listing) | 36864 | — |
| Number of I/O | 114 | — |
| Maximum System Frequency | 350 MHz | — |
| Processor Core | ARM Cortex-M1 (optional ARM support, M1 variant) | ARM Cortex-M1 |
| Technology | 130-nm, 7-layer metal, flash-based CMOS | 130 nm flash-based |
| Configuration Memory | Nonvolatile flash (Live at Power-Up, LAPU) | — |
| Security | 128-bit flash-based lock, AES decryption | 128-bit flash lock, AES decryption |
| Tegangan Pemuat Kerja | 1.5 V | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +85 C | — |
| Paket / Case | 256-LBGA (FBGA), 1.00 mm ball pitch | — |
| Gaya Mounting | SMD/SMT | — |
| Packaging | Tray | — |
| Mixed-Signal Features | Configurable analog, flash memory blocks, clock generation and management | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Family | — | Fusion (M1 series, mixed-signal FPGA) |
| User I/O | — | 114 |
| User Flash Memory | — | 36864 bits |
| Core Supply Voltage | — | 1.5 V |
| Maximum Performance | — | 1282.05 MHz (per FindIC spec summary) |
| Configuration | — | Flash-based, live at power-up |
| Paket | — | 256-LBGA (FG256) |
| Tipe Mounting | — | Surface Mount |
| Analog Blocks | — | Integrated configurable analog (Fusion) |
| Clock Management | — | Integrated clock generation and management circuitry |
| Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |