M29F800FB55N3F2 vs M29F160FT55N3F2 Perbandingan
Perbandingan bersamaan detil M29F800FB55N3F2 dari Micron Technology dan M29F160FT55N3F2 dari Micron Technology. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Micron Technology
M29F800FB55N3F2 - 8Mbit 5V Parallel NOR Flash 55ns | Micron
M29F800FB55N3F2 ✓ AktifMicron Technology
M29F160FT55N3F2 - 16Mbit 5V 55ns NOR Flash | Micron Technology
M29F160FT55N3F2 ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | M29F800FB55N3F2 | M29F160FT55N3F2 |
|---|---|---|
| Merek | Micron Technology | Micron Technology |
| Kategori | Memory ICs | Flash |
| Status Lingkungan Hidup | Aktif | Aktif |
| Memory Density | 8389 kbits (8 Mbit) | — |
| Organisasi | 1M x 8 / 512K x 16 | 1M x 16 / 2M x 8 |
| Tegangan Pemuat | 5 V | — |
| Access Time | 55 ns | 55 ns |
| Tipe Antarmuka | Parallel NOR | — |
| Boot Block Architecture | Bottom Boot Block | — |
| Program/Erase Controller | Embedded byte/word program algorithms | — |
| Suhu Kerja | -40C to +125C | -40C to +125C |
| Temperature Grade | Automotive (AEC-Q100) | — |
| Package Type | 48-pin TSOP1 | — |
| Package Shape | Rectangular (JESD designation TSOP1) | — |
| Terminal Count | 48 | — |
| JESD-609 Termination Code | e3 (lead-free) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Packaging | Tape & Reel (T/R) | Tape & Reel |
| Status RoHS | Compliant (lead-free terminations) | [DATA_NEEDED: RoHS status] |
| Tipe Memori | — | NOR Flash (Parallel, Asynchronous) |
| Density | — | 16 Mbit (16777 kbits) |
| Number of Words | — | 1000 k |
| Bits per Word | — | 16 bits |
| Supply Voltage (VCC) | — | 5 V (operating 4.5 V) |
| Antarmuka | — | Parallel |
| Synchronous / Asynchronous | — | Asynchronous |
| Boot Block Location | — | Top boot block (FT) |
| Paket | — | 48-Pin TSOP |
| Program / Erase | — | Embedded byte/word program algorithms (controller on-chip) |
| Level MSL | — | [DATA_NEEDED: moisture sensitivity level] |