MC860ENCVR50D4R2 vs MPC860DEZQ50D4 Perbandingan

Perbandingan bersamaan detil MC860ENCVR50D4R2 dari NXP dan MPC860DEZQ50D4 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MPC860DEZQ50D4 MPC860DEZQ50D4 - PowerQUICC MPU 50MHz 357-BGA | NXP

MPC860DEZQ50D4 - PowerQUICC MPU 50MHz 357-BGA | NXP

MPC860DEZQ50D4 Nrnd

Perbandingan Spesifikasi

Parameter Umum MC860ENCVR50D4R2 MPC860DEZQ50D4
Merek NXP NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Obsolete NRND
Processor Family MPC8xx PowerQUICC —
Core Architecture PowerPC 32-bit Power Architecture (embedded)
Core Count 1 —
Frekuensi Bawah Maximum 50 MHz —
Tegangan Pemuat Kerja 3.3 V —
Paket / Case 357-BBGA (PBGA, 25 x 25 mm) —
Pitch 1.27 mm —
Tipe Mounting Surface Mount, BGA Surface Mount (BGA)
Packaging Digi-Reel / Tape and Reel Tray
Lead Free Status Lead Free —
Status RoHS RoHS compliant Contains Lead (legacy BGA)
Communications Module CPM (SCC/SMC/UART/SPI) —
Suhu Kerja [DATA_NEEDED: Operating Temperature] 0 C to +95 C
JTAG / Debug Interface Yes (BDM/JTAG) —
Memory Controller Integrated DRAM/SRAM/Flash + PCMCIA —
Process Technology 0.32 um CMOS —
Processor Type — MPC8xx PowerQUICC, 32-bit
Core Frequency — 50 MHz
Communications Processor Module — CPM with HDLC, Ethernet, PCMCIA, SCC
Ethernet MAC — 10/100 Mbps integrated
HDLC/SDLC Channels — Yes (multi-channel)
PCMCIA Interface — Yes
Supply Voltage (I/O) — 3.3 V
Paket — 357-Ball PBGA (25x25 mm)
Lead-Free Status — Contains Lead
Sub-Brand Heritage — Freescale / NXP PowerQUICC

Spek dan Sumber

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