MC8641DTHX1333JE vs MC8641DTVU1000GE Perbandingan
Perbandingan bersamaan detil MC8641DTHX1333JE dari NXP Semiconductors dan MC8641DTVU1000GE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC8641DTHX1333JE - PowerPC e600 Dual-Core 1.333GHz MPU | NXP
MC8641DTHX1333JE ObsoleteNXP Semiconductors
MC8641DTVU1000GE - Dual-Core 1GHz PowerPC SoC | NXP
MC8641DTVU1000GE ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | MC8641DTHX1333JE | MC8641DTVU1000GE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Obsolete | Waktu Pembelian Terakhir |
| Core Processor | PowerPC e600 | — |
| Series | MPC86xx | — |
| Number of Cores | 2 | 2 |
| Lebar Bus Data | 32-Bit | — |
| Speed | 1.333 GHz | — |
| Core Voltage | 0.95 V | — |
| RAM Controllers | DDR, DDR2 | — |
| Graphics Acceleration | No | — |
| Ethernet | 10/100/1000 Mbps (dual MAC) | — |
| Display & Interface Controllers | Not specified | — |
| Co-Processors / DSP | Not specified | — |
| Paket | 1023-ball FCCBGA (33x33 mm) | 1023-ball FCCBGA (33x33 mm) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Silicon Revision | G8 REV 3.0 | Rev 3.0 (G8) |
| Suhu Kerja | -40C to +105C | -40C to +105C |
| Terminal Finish | Tin/Lead (Sn/Pb) | — |
| Peak Reflow Temperature | 245 C (max 30 s) | — |
| Technology | CMOS | — |
| Status RoHS | RoHS non-compliant (Sn/Pb finish) | Compliant (per distributor listings) |
| Part Status | Obsolete | — |
| Processor Type | — | PowerPC e600 (MPC86xx) Dual-Core SoC |
| Core Architecture | — | Superscalar e600, 32-bit, 3-issue / 7-stage pipeline |
| Core Frequency | — | 1.0 GHz |
| SIMD Engine | — | AltiVec per core |
| Core Supply Voltage | — | 1.05 V (0.95 V variant per part suffix) |
| I/O Supply Voltages | — | 1.8 V / 2.5 V / 3.3 V |
| Memory Controller | — | Integrated DDR1/DDR2 with ECC |
| Integrated MACs | — | Gigabit Ethernet (GbE) |
| PCI Express | — | PCIe interfaces integrated |
| Serial RapidIO (SRIO) | — | Integrated SRIO fabric |
| Process Technology | — | 0.09 um CMOS |