MC8641VJ1500KE vs MC8641VU1500KE Perbandingan

Perbandingan bersamaan detil MC8641VJ1500KE dari NXP Semiconductors dan MC8641VU1500KE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MC8641VJ1500KE MC8641VJ1500KE - PowerPC e600 SoC 1.5GHz 994-FCCBGA | NXP

MC8641VJ1500KE - PowerPC e600 SoC 1.5GHz 994-FCCBGA | NXP

MC8641VJ1500KE ✗ Akhir Hidup
NXP Semiconductors
MC8641VU1500KE MC8641VU1500KE - PowerPC e600 MPU, 1.5GHz, 994-FCCBGA | NXP

MC8641VU1500KE - PowerPC e600 MPU, 1.5GHz, 994-FCCBGA | NXP

MC8641VU1500KE Obsolete

Perbandingan Spesifikasi

Parameter Umum MC8641VJ1500KE MC8641VU1500KE
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Akhir Hidup Obsolete
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) —
Series / Family MPC8641 (single-core PowerPC e600) —
Core PowerPC e600 (32-bit Power Architecture, 3-issue superscalar) —
Number of Cores 1 1
Maximum Core Frequency 1.5 GHz (1500 MHz) 1.5 GHz
Rentang Suhu Kerja 0 °C to +105 °C (commercial, "KE" suffix) —
Silicon Revision Rev 3 —
SIMD / Vector Engine AltiVec on-die —
Memory Controller 64-bit DDR1/DDR2 with ECC —
Ethernet Dual Gigabit Ethernet MACs 4 x 10/100/1000 Mbps MAC
PCI Express x4 / x8 PCIe interface Dual x4 PCIe endpoints
Serial RapidIO Dual 4x Serial RapidIO (SRIO) ports Yes
Paket 994-ball FCCBGA, 33 x 33 mm 994-FCCBGA (33x33 mm), ceramic flip-chip
Tipe Mounting Surface Mount (BGA) —
Bit Width 32-bit —
Status RoHS [DATA_NEEDED: rohs_status from NXP product page] RoHS compliant (ceramic BGA)
Level MSL [DATA_NEEDED: MSL rating] —
Supply Voltage (Core) [DATA_NEEDED: Vcore nominal from datasheet] 1.05 V
Core Processor — PowerPC e600
Lebar Bus Data — 32-bit
Supply Voltage (I/O) — 1.1 V / 1.8 V / 2.5 V / 3.3 V
RAM Controllers — DDR1, DDR2 (with ECC)
AltiVec SIMD Engine — Yes (128-bit)
Cryptographic Acceleration — AES, DES/3DES, RSA, ECC
Jumlah Pin — 1023 (effective BGA balls)
Suhu Kerja — 0°C to +105°C
Process Technology — 90 nm CMOS

Spek dan Sumber

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