MC9328MXLDVM15-FR vs MC9328MXLVP15 Perbandingan
Perbandingan bersamaan detil MC9328MXLDVM15-FR dari NXP Semiconductors dan MC9328MXLVP15 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9328MXLDVM15-FR - i.MXL ARM920T 200MHz Microprocessor | NXP
MC9328MXLDVM15-FR Nrnd
Perbandingan Spesifikasi
| Parameter Umum | MC9328MXLDVM15-FR | MC9328MXLVP15 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Obsolete |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| MPN | MC9328MXLDVM15-FR | — |
| Core Architecture | ARM920T (ARM9TDMI core with MMU) | — |
| Core Frequency | 200 MHz | — |
| Instruction Set Width | 32-bit | — |
| L1 Instruction Cache | 16 KB | — |
| L1 Data Cache | 16 KB | — |
| MMU | Yes (full ARM MMU) | — |
| Paket | LFBGA-256 (MAP) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Rentang Suhu Kerja | -40C to +85C (industrial, per -FR suffix / DVM15 speed code family) | — |
| Process Technology | 0.18 um CMOS | — |
| Supply Voltage (Core) | 1.8 V nominal | — |
| Supply Voltage (I/O) | 3.3 V nominal | — |
| On-chip Peripherals | LCD controller, USB 1.1 device/host, 10/100 Ethernet MAC, SD/MMC, 3x UART, 2x SPI, 2x I2C, PWM, RTC, PCM/I2S audio | — |
| Memory Bus | External SDRAM and NAND flash controllers | — |
| Packing Style | Factory Reel (FR suffix) | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Level MSL | [DATA_NEEDED: MSL rating] | — |
| Core | — | ARM920T (32-bit RISC) |
| Architecture | — | RISC |
| Lebar Bus Data | — | 32-bit |
| Maximum Clock Speed | — | 150 MHz |
| Core Type | — | ARM920T |
| Instruction Set | — | ARMv4T (ARM/Thumb) |
| I-Cache | — | 16 KB |
| D-Cache | — | 16 KB |
| Tegangan Pemuat Kerja | — | 1.8 V (core) / 3.3 V (I/O) |
| Package Type | — | 225-MAPBGA (Plastic, Mold Array Process BGA) |
| Package Size | — | 13 x 13 mm |
| Ball Pitch | — | 0.80 mm |
| Jumlah Pin | — | 225 |
| Integrated LCD Controller | — | Yes (STN/TFT) |
| USB Device Controller | — | Yes (USB 1.1) |
| MMC/SD Host Controller | — | Yes |