MC9RS08KB8CTG vs MC9RS08KB4CWJ Perbandingan
Perbandingan bersamaan detil MC9RS08KB8CTG dari NXP Semiconductors dan MC9RS08KB4CWJ dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9RS08KB4CWJ - 8-bit RS08 MCU, 4KB Flash, 20MHz | NXP
MC9RS08KB4CWJ ✗ Akhir HidupPerbandingan Spesifikasi
| Parameter Umum | MC9RS08KB8CTG | MC9RS08KB4CWJ |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Akhir Hidup |
| Core | RS08 (subset of HC08 with BGND) | — |
| Lebar Bus Data | 8 bit | 8-bit |
| Program Memory Size | 8 KB (8K x 8) Flash | 4 KB (4K x 8) Flash |
| Maximum CPU Frequency | 20 MHz | — |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.5 V to 5.5 V |
| Rentang Suhu Kerja | -40C to +85C | — |
| Paket | 16-TSSOP (0.173", 4.40 mm width) | 20-pin SOIC (wide-body, tube) |
| Tipe Mounting | Surface Mount | Surface Mount |
| On-chip RAM | [DATA_NEEDED: RAM size] | — |
| On-chip EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Number of I/O Pins | [DATA_NEEDED: I/O pin count] | — |
| Interrupt Structure | Single global interrupt vector | — |
| Debug Interface | RS08 background debug (BGND instruction) | Background Debug Mode (BDM) |
| Peripherals | ADC, Timers, Communication interfaces (per datasheet) | LVD, POR, PWM, WDT |
| Status RoHS | Compliant (per distributor listings) | [DATA_NEEDED: RoHS compliance status] |
| Core Processor | — | RS08 |
| Core Size | — | 8-bit |
| CPU Speed | — | 20 MHz |
| RAM Size | — | 126 B |
| EEPROM Size | — | None (Flash-based) |
| Number of I/O | — | 18 |
| Connectivity | — | I2C, SPI |
| Instruction Set | — | HC08 subset + BGND |
| Suhu Kerja | — | -40C to +85C |
| Level MSL | — | [DATA_NEEDED: MSL moisture sensitivity level] |