MC9S08AC60CFUE vs S9S08AW60E5MFGE Perbandingan

Perbandingan bersamaan detil MC9S08AC60CFUE dari NXP Semiconductors dan S9S08AW60E5MFGE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
S9S08AW60E5MFGE S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)

S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)

S9S08AW60E5MFGE ✓ Aktif

Perbandingan Spesifikasi

Parameter Umum MC9S08AC60CFUE S9S08AW60E5MFGE
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND Aktif
Core HCS08 (8-bit) —
CPU Frequency 40 MHz (20 MHz internal bus) —
Flash Memory 60 KB —
RAM 2 KB [DATA_NEEDED: RAM size]
Tegangan Pemuat 2.7 V to 5.5 V 3 V / 3.3 V / 5 V
I/O Pins 54 [DATA_NEEDED: GPIO count]
Paket 64-QFP (14x14 mm) 44-pin LQFP (10 x 10 mm)
ADC 10-bit, up to 16 channels Multi-channel 10-bit (per family)
SCI Modules 2 (LIN 2.0 / SAE J2602) —
SPI Modules 1 —
IIC Modules 1 —
Timers Multiple PWM-capable channels TPM modules with PWM channels
Suhu Kerja -40C to +85C / +105C (automotive) -40C to +125C (automotive range)
Tipe Mounting Surface Mount Surface Mount
RoHS Compliant —
Lifecycle NRND (Not Recommended for New Designs) —
Core Architecture — HCS08 (S08 enhanced), 8-bit CISC
CPU Clock (Max) — 40 MHz (20 MHz bus)
Program Flash — 60 KB (60K x 8)
EEPROM / Data Flash — [DATA_NEEDED: data EEPROM size]
Communication — SCI (UART), SPI, I2C
Debug Interface — BDM (Background Debug Mode)
Family — S08 / MC9S08AW60 series
Automotive/Industrial — Dual-targeted
Lead Free / RoHS — Yes (per suffix "E" = Pb-free, "R" = tape & reel)

Spek dan Sumber

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