MC9S12D64CFUE vs MC9S12D64MFUER Perbandingan

Perbandingan bersamaan detil MC9S12D64CFUE dari NXP Semiconductors dan MC9S12D64MFUER dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MC9S12D64CFUE MC9S12D64CFUE - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP

MC9S12D64CFUE - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP

MC9S12D64CFUE Nrnd

Perbandingan Spesifikasi

Parameter Umum MC9S12D64CFUE MC9S12D64MFUER
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND NRND
Core HCS12 (16-bit CISC) —
Maximum CPU Frequency 25 MHz —
Program Memory (Flash) 64 KB (64K x 8) —
RAM 4 KB —
EEPROM 1 KB —
Number of I/O 59 59
ADC 8-channel, 10-bit 2 x 10-bit, 8 channels each (16 ADC channels total)
Tegangan Pemuat 2.5 V / 5 V 2.5 V / 5 V
Paket 80-QFP (14 x 14 mm) 80-QFP (14 x 14 mm), also called PQFP-80
Tipe Mounting Surface Mount Surface Mount (SMD/SMT)
Communication Peripherals 2x SCI (UART), SPI, I2C, MSCAN (CAN 2.0A/B) —
Timers ECT, TIM, PWM, PIT —
Suhu Kerja [DATA_NEEDED: operating temperature range] —
Status RoHS [DATA_NEEDED: RoHS compliance status] Compliant
Packaging Tray —
Core Architecture — HCS12 (16-bit CISC)
CPU Core — S12 CPU V2
Operating Frequency — 25 MHz
Program Memory Type — Flash
Program Memory Size — 64 KB (64K x 8)
PWM Channels — 8 channels
Capture/Compare Timers — 8-channel Enhanced Capture Timer (ECT)
Communication Interfaces — 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC
Rentang Suhu Kerja — -40 C to +125 C
Automotive Qualification — AEC-Q100
Packaging Method (tray / reel) — Tray
Approximate Weight — 0.033 oz (per supplier catalog)
Debug Interface — BDM (Background Debug Mode)
Watchdog / COP — Yes (COP reset, watchdog timer)

Spek dan Sumber

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