MC9S12D64CFUE vs MC9S12D64MFUER Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12D64CFUE disebabkan oleh NXP Semiconductors dan MC9S12D64MFUER disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MC9S12D64CFUE MC9S12D64CFUE - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP

MC9S12D64CFUE - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP

MC9S12D64CFUE Nrnd

Pengandingan Spesifikasi

Parametr MC9S12D64CFUE MC9S12D64MFUER
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND NRND
Core HCS12 (16-bit CISC) —
Maximum CPU Frequency 25 MHz —
Program Memory (Flash) 64 KB (64K x 8) —
RAM 4 KB —
EEPROM 1 KB —
Number of I/O 59 59
ADC 8-channel, 10-bit 2 x 10-bit, 8 channels each (16 ADC channels total)
Tegangan Pemberi Arus 2.5 V / 5 V 2.5 V / 5 V
Kemasan 80-QFP (14 x 14 mm) 80-QFP (14 x 14 mm), also called PQFP-80
Jenis Pemasangan Surface Mount Surface Mount (SMD/SMT)
Communication Peripherals 2x SCI (UART), SPI, I2C, MSCAN (CAN 2.0A/B) —
Timers ECT, TIM, PWM, PIT —
Suhu Operasi [DATA_NEEDED: operating temperature range] —
Status RoHS [DATA_NEEDED: RoHS compliance status] Compliant
Packaging Tray —
Core Architecture — HCS12 (16-bit CISC)
CPU Core — S12 CPU V2
Operating Frequency — 25 MHz
Program Memory Type — Flash
Program Memory Size — 64 KB (64K x 8)
PWM Channels — 8 channels
Capture/Compare Timers — 8-channel Enhanced Capture Timer (ECT)
Communication Interfaces — 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC
Gambaran Suhu Operasi — -40 C to +125 C
Automotive Qualification — AEC-Q100
Packaging Method (tray / reel) — Tray
Approximate Weight — 0.033 oz (per supplier catalog)
Debug Interface — BDM (Background Debug Mode)
Watchdog / COP — Yes (COP reset, watchdog timer)

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