MC9S12D64MFUER vs MC9S12D64MPVE Perbandingan

Perbandingan bersamaan detil MC9S12D64MFUER dari NXP Semiconductors dan MC9S12D64MPVE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum MC9S12D64MFUER MC9S12D64MPVE
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND NRND
Core Architecture HCS12 (16-bit CISC) —
CPU Core S12 CPU V2 —
Operating Frequency 25 MHz —
Program Memory Type Flash Flash
Program Memory Size 64 KB (64K x 8) 64 KB (64K x 8)
Paket 80-QFP (14 x 14 mm), also called PQFP-80 —
Tipe Mounting Surface Mount (SMD/SMT) Surface Mount
Tegangan Pemuat 2.5 V / 5 V —
Number of I/O 59 91
ADC 2 x 10-bit, 8 channels each (16 ADC channels total) Two 8-channel, 10-bit
PWM Channels 8 channels 8
Capture/Compare Timers 8-channel Enhanced Capture Timer (ECT) —
Communication Interfaces 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC —
Rentang Suhu Kerja -40 C to +125 C —
Automotive Qualification AEC-Q100 —
Status RoHS Compliant Compliant
Packaging Method (tray / reel) Tray —
Approximate Weight 0.033 oz (per supplier catalog) —
Debug Interface BDM (Background Debug Mode) —
Watchdog / COP Yes (COP reset, watchdog timer) —
Core — HCS12 (16-bit CISC)
Maximum CPU Frequency — 25 MHz
RAM Size — 4 KB
Paket / Case — 112-LQFP (20 x 20 mm)
Oscillator Type — Internal
Tegangan Pemuat Kerja — 2.5 V / 5 V
Timers — 8-channel IC/OC enhanced capture timer
Serial Interfaces — 2x SCI (asynchronous)
I2C (Inter-IC Bus) — Yes
Packaging — Tray

Spek dan Sumber

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