MC9S12DJ64MFUE vs MC9S12D64MFUE Perbandingan

Perbandingan bersamaan detil MC9S12DJ64MFUE dari NXP Semiconductors dan MC9S12D64MFUE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MC9S12DJ64MFUE MC9S12DJ64MFUE - HCS12 16-bit MCU 64KB Flash 80-QFP | NXP

MC9S12DJ64MFUE - HCS12 16-bit MCU 64KB Flash 80-QFP | NXP

MC9S12DJ64MFUE Nrnd
NXP Semiconductors
MC9S12D64MFUE MC9S12D64MFUE - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP

MC9S12D64MFUE - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP

MC9S12D64MFUE Nrnd

Perbandingan Spesifikasi

Parameter Umum MC9S12DJ64MFUE MC9S12D64MFUE
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND NRND
Core Architecture HCS12 (CISC, 16-bit) HCS12 (16-bit CISC)
CPU Frequency 25 MHz —
Program Memory 64 KB Flash (64K x 8) —
RAM Size 4 KB —
EEPROM Size 1 KB —
Data Flash (Emulation) 8 KB shared Flash region [DATA_NEEDED: confirmed address range] —
CAN Modules 2x msCAN 2.0 A/B —
SCI / SPI 2x SCI, 1x SPI —
ADC 8-channel, 10-bit 2 x 10-bit, 8 channels each (16 ADC channels total)
Timers ECT (Enhanced Capture Timer), 16-bit, 8-channels —
PWM Channels 8 (4x 16-bit or 8x 8-bit via ECT) 8 channels
GPIO Count [DATA_NEEDED: exact GPIO count per package] —
Operating Voltage 5 V (typical, 2.5 V for MCU core via internal regulator) [DATA_NEEDED: full min/max range] —
Suhu Kerja -40C to +125C —
Package Type 80-QFP (14x14 mm) —
Tipe Mounting Surface Mount Surface Mount (SMD/SMT)
Debug Interface Background Debug Mode (BDM), single-wire BDM (Background Debug Mode)
Status RoHS Compliant Compliant
CPU Core — S12 CPU V2
Operating Frequency — 25 MHz
Program Memory Type — Flash
Program Memory Size — 64 KB (64K x 8)
Paket — 80-QFP (14 x 14 mm), also called PQFP-80
Tegangan Pemuat — 2.5 V / 5 V
Number of I/O — 59
Capture/Compare Timers — 8-channel Enhanced Capture Timer (ECT)
Communication Interfaces — 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC
Rentang Suhu Kerja — -40 C to +125 C
Automotive Qualification — AEC-Q100
Packaging Method (tray / reel) — Tray
Approximate Weight — 0.033 oz (per supplier catalog)
Watchdog / COP — Yes (COP reset, watchdog timer)

Spek dan Sumber

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