MC9S12DJ64MFUE vs MC9S12D64MFUE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12DJ64MFUE disebabkan oleh NXP Semiconductors dan MC9S12D64MFUE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MC9S12DJ64MFUE | MC9S12D64MFUE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | NRND |
| Core Architecture | HCS12 (CISC, 16-bit) | HCS12 (16-bit CISC) |
| CPU Frequency | 25 MHz | — |
| Program Memory | 64 KB Flash (64K x 8) | — |
| RAM Size | 4 KB | — |
| EEPROM Size | 1 KB | — |
| Data Flash (Emulation) | 8 KB shared Flash region [DATA_NEEDED: confirmed address range] | — |
| CAN Modules | 2x msCAN 2.0 A/B | — |
| SCI / SPI | 2x SCI, 1x SPI | — |
| ADC | 8-channel, 10-bit | 2 x 10-bit, 8 channels each (16 ADC channels total) |
| Timers | ECT (Enhanced Capture Timer), 16-bit, 8-channels | — |
| PWM Channels | 8 (4x 16-bit or 8x 8-bit via ECT) | 8 channels |
| GPIO Count | [DATA_NEEDED: exact GPIO count per package] | — |
| Operating Voltage | 5 V (typical, 2.5 V for MCU core via internal regulator) [DATA_NEEDED: full min/max range] | — |
| Suhu Operasi | -40C to +125C | — |
| Package Type | 80-QFP (14x14 mm) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (SMD/SMT) |
| Debug Interface | Background Debug Mode (BDM), single-wire | BDM (Background Debug Mode) |
| Status RoHS | Compliant | Compliant |
| CPU Core | — | S12 CPU V2 |
| Operating Frequency | — | 25 MHz |
| Program Memory Type | — | Flash |
| Program Memory Size | — | 64 KB (64K x 8) |
| Kemasan | — | 80-QFP (14 x 14 mm), also called PQFP-80 |
| Tegangan Pemberi Arus | — | 2.5 V / 5 V |
| Number of I/O | — | 59 |
| Capture/Compare Timers | — | 8-channel Enhanced Capture Timer (ECT) |
| Communication Interfaces | — | 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC |
| Gambaran Suhu Operasi | — | -40 C to +125 C |
| Automotive Qualification | — | AEC-Q100 |
| Packaging Method (tray / reel) | — | Tray |
| Approximate Weight | — | 0.033 oz (per supplier catalog) |
| Watchdog / COP | — | Yes (COP reset, watchdog timer) |