MC9S12DT256CPVE vs MC9S12E256MPVE Perbandingan
Perbandingan bersamaan detil MC9S12DT256CPVE dari NXP Semiconductors dan MC9S12E256MPVE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9S12DT256CPVE - 16-bit HCS12 MCU 256KB Flash | NXP LQFP-112
MC9S12DT256CPVE NrndPerbandingan Spesifikasi
| Parameter Umum | MC9S12DT256CPVE | MC9S12E256MPVE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Obsolete |
| Core Processor | HCS12 (CPU12 CISC) | — |
| Core Size | 16-bit | 16-bit |
| Frekuensi Bawah Maximum | 25 MHz | — |
| Program Memory Size | 256 KB (256K x 8) Flash | — |
| RAM Size | 12 KB | — |
| EEPROM Size | 4 KB | — |
| Lebar Bus Data | 16-bit | — |
| Tegangan Pemuat | 2.35 V to 2.75 V (core), 5 V I/O tolerant typical | 5 V single rail (Vreg internal) |
| Number of I/O Pins | 91 | — |
| ADC | 2x 8-channel, 10-bit | 8-channel, 10-bit |
| PWM Channels | 8 channels | 6 |
| Connectivity | CAN, I2C, SCI (UART), SPI | EBI/EMI, I2C, SPI, SCI |
| Timers | 8-channel Enhanced Capture Timer (ECT) | — |
| Paket | 112-pin LQFP (20x20 mm) | 112-LQFP (20x20 mm) |
| Suhu Kerja | -40C to +85C (industrial, per 'P' suffix family) | [DATA_NEEDED: operating temperature range] |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS status from manufacturer] | — |
| Debug Interface | BDM (Background Debug Mode) | — |
| Watchdog | COP (Computer Operating Properly) watchdog | — |
| Core | — | HCS12 |
| Maximum CPU Speed | — | 25 MHz |
| Program Memory | — | 256 KB Flash |
| RAM | — | 16 KB |
| Jumlah Pin | — | 112 |
| SCI Modules | — | 3 (asynchronous serial) |
| SPI Modules | — | 1 |
| IIC Modules | — | 1 (Inter-IC Bus) |
| Timer Modules | — | 3 x 16-bit, 4-channel |
| RoHS | — | [DATA_NEEDED: RoHS status] |