MC9S12DT256MPVE vs MC9S12A128BCPV Perbandingan
Perbandingan bersamaan detil MC9S12DT256MPVE dari NXP Semiconductors dan MC9S12A128BCPV dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DT256MPVE NrndPerbandingan Spesifikasi
| Parameter Umum | MC9S12DT256MPVE | MC9S12A128BCPV |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Aktif |
| Core | HCS12 (16-bit CISC) | — |
| Maximum CPU Frequency | 25 MHz | — |
| Program Memory (Flash) | 256 KB | — |
| RAM | 12 KB | — |
| EEPROM | 4 KB | [DATA_NEEDED: EEPROM size] |
| Lebar Bus Data | 16-bit | — |
| Tegangan Pemuat | 2.35 V to 2.75 V (regulated core) | — |
| I/O Pins | 91 | — |
| ADC | 2 x 10-bit, 8 channels each (16 channels total) | — |
| Timers | 8-channel Enhanced Capture Timer (ECT) | — |
| Communication Interfaces | 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) | — |
| Paket | 112-LQFP (20x20 mm) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | -40C to +125C (automotive grade) | -40C to +85C (industrial) |
| Debug Interface | Background Debug Mode (BDM) + JTAG | — |
| Status RoHS | Compliant | [DATA_NEEDED] |
| Status Lingkungan Hidup | NRND (Not Recommended for New Designs) | — |
| Manufacturer | — | NXP USA Inc. |
| Series | — | HCS12 |
| Core Processor | — | HCS12 (16-bit CISC) |
| Core Size | — | 16-Bit |
| Speed | — | 25 MHz |
| Program Memory Size | — | 128 KB (128K x 8) FLASH |
| RAM Size | — | 4 KB |
| Number of I/O | — | 91 |
| Paket / Case | — | 112-LQFP (20 x 20 mm) |
| Oscillator Type | — | External |
| A/D Channels | — | [DATA_NEEDED: A/D channel count and resolution] |
| Connectivity | — | CAN, SCI, SPI, JTAG/BDM |
| Voltage Supply | — | [DATA_NEEDED: VDD range] |