MCF5274CVM166 vs SCF5250VM120 Perbandingan

Perbandingan bersamaan detil MCF5274CVM166 dari NXP Semiconductors dan SCF5250VM120 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MCF5274CVM166 MCF5274CVM166 - 166MHz 32-Bit ROMless MPU | NXP | BGA

MCF5274CVM166 - 166MHz 32-Bit ROMless MPU | NXP | BGA

MCF5274CVM166 Nrnd
NXP Semiconductors
SCF5250VM120 SCF5250VM120 - 120MHz ColdFire Microcontroller | NXP

SCF5250VM120 - 120MHz ColdFire Microcontroller | NXP

SCF5250VM120 Unknown

Perbandingan Spesifikasi

Parameter Umum MCF5274CVM166 SCF5250VM120
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND Unknown
Product Type 32-bit ROMless integrated microprocessor 32-bit ROMless microcontroller
Processor Core ColdFire V2 ColdFire V2 MCF52xx
Frekuensi Bawah Maximum 166 MHz —
Instruction Width 32 bit —
Program Memory Type ROMless —
External Oscillator External —
Paket 256-map BGA, 17 mm x 17 mm 196-LBGA (15 x 15 mm)
Tipe Mounting Surface mount —
Nominal I/O Supply Voltage 2.5 V / 3.3 V —
Core Supply Range in Cross-Reference Result 1.4 V to 1.6 V —
Suhu Kerja -40°C to 85°C [DATA_NEEDED: operating temperature range]
RAM Organization Reported by Third-Party Listing 64K x 8 —
Program Memory Size [DATA_NEEDED: program memory size] —
EEPROM Size [DATA_NEEDED: EEPROM size] —
Number of GPIO Pins [DATA_NEEDED: GPIO pin count] —
Ethernet Interface [DATA_NEEDED: Ethernet interface configuration] —
External Memory Interface [DATA_NEEDED: external memory interface configuration] —
RoHS Compliance [DATA_NEEDED: RoHS compliance] —
REACH Compliance [DATA_NEEDED: REACH compliance] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] [DATA_NEEDED: AEC-Q100 qualification]
Architecture — RISC 32-bit
Maximum Processor Frequency — 120 MHz
RAM Size — 128 kB
Program Memory — ROMless
Number of I/O Pins — 57
Tegangan Pemuat — 3.3 V
Process Technology — 0.13 um
Package Type — MAP-BGA-196
Tray Packaging — Tray
Manufacturer — NXP Semiconductors
Datasheet File Size — 1 MB
Datasheet Page Count — 56 pages
Status RoHS — [DATA_NEEDED: RoHS compliance]
REACH Status — [DATA_NEEDED: REACH compliance]

Spek dan Sumber

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