MCF53010CQT240 vs MCF53011CQT240 Perbandingan
Perbandingan bersamaan detil MCF53010CQT240 dari NXP Semiconductors dan MCF53011CQT240 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MCF53010CQT240 | MCF53011CQT240 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Core Architecture | ColdFire V3 (Version 3) with EMAC | — |
| Core Type | 32-bit MPU (ROMless) | — |
| Maximum Core Frequency | 240 MHz | — |
| Dhrystone 2.1 MIPS | Up to 211 MIPS @ 240 MHz | 211 MIPS |
| Unified Cache | 16 KBytes (instruction/data) | — |
| Internal SRAM | 128 KBytes | 128 KBytes |
| Program Memory | ROMless (external memory required) | — |
| Tegangan Pemuat | 3.3 V I/O | — |
| Paket | 208-LQFP (28x28 mm) | 208-TQFP (28 x 28 mm) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | -40C to +85C (industrial) | — |
| Ethernet | 10/100 MAC (EMAC) | 10/100 MAC with EMAC, MII/RMII |
| USB | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed Host/Device/OTG |
| Other Connectivity | CAN, I2C, SPI, UART | — |
| Voice Codec | Integrated codec with amplifiers | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Level MSL | 3 (per JEDEC J-STD-020) | [DATA_NEEDED: MSL level] |
| Core | — | ColdFire V3 with EMAC |
| Architecture | — | 32-bit ColdFire Version 3 |
| Frekuensi Bawah Maximum | — | 240 MHz |
| Instruction/Data Cache | — | 16 KBytes unified |
| External Memory | — | ROMless, SDRAM/NOR/NAND interface |
| Jumlah Pin | — | 208 |
| Terminal Form | — | GULL WING |
| Package Code | — | QFP (208-TQFP) |
| CAN | — | CAN 2.0B controller |
| Voice Codec Interface | — | TDM/I2S, multi-channel |
| Other Peripherals | — | UART, I2C, SPI, GPIO, eSDHC, DMA, Timers |
| Operating Temperature Grade | — | Industrial |